Abstract: An apparatus arranged for deflecting an optical component for alignment purposes of the optical component with a further optical component, wherein the apparatus comprises a plurality of adjacently placed elongate carriers, extending mutually parallel to each other in a longitudinal direction, wherein two adjacently placed elongate carriers have a spacing between them for receiving a first optical component such that the received optical component rests against two adjacently placed elongate carriers, wherein the two elongate carriers have slopes such that the spacing between the two adjacently placed elongate carriers is smaller at a bottom side compared to the spacing at a top side of the carriers, wherein the carriers comprise piezoelectric material configured to deflect the carriers in a direction perpendicular to the longitudinal direction by actuating the piezoelectric material.

Abstract: An optical interconnect includes CMOS drivers/receivers, vertical cavity surface emitting lasers (VCSEL) or photo detectors (PD), a silicon interposer having a electrical interface connected to a pattern of wet etched square-box shape optical through silicon vias (OTSV), the CMOS drivers/receivers are connected to the electrical interface, the VCSEL/PDs are connected to the end of the electrical interface, each input/output signal of the VCSEL/PDs are aligned with the pattern of OTSVs, an optical interface (OI) connected to a second side of the interposer, the optical interface is aligned with the OTSVs, the optical interface planar surface is on the silicon interposer second side and a pattern lenses opposite the planar surface and match the OTSVs, and a lensed ferrule having a pattern of lenses arranged to match the pattern of optical interface lenses, the ferrule connects with optical fiber arrays to directly connect to all the drivers or receivers.

Abstract: An optical interconnect includes CMOS drivers/receivers, vertical cavity surface emitting lasers (VCSEL) or photo detectors (PD), a silicon interposer having a electrical interface connected to a pattern of wet etched square-box shape optical through silicon vias (OTSV), the CMOS drivers/receivers are connected to the electrical interface, the VCSEL/PDs are connected to the end of the electrical interface, each input/output signal of the VCSEL/PDs are aligned with the pattern of OTSVs, an optical interface (01) connected to a second side of the interposer, the optical interface is aligned with the OTSVs, the optical interface planar surface is on the silicon interposer second side and a pattern lenses opposite the planar surface and match the OTSVs, and a lensed ferrule having a pattern of lenses arranged to match the pattern of optical interface lenses, the ferrule connects with optical fiber arrays to directly connect to all the drivers or receivers.

Abstract: An optical waveguide coupler is provided that includes an InP substrate, a guiding core layer disposed on the InP substrate, a top cladding layer disposed on the guiding core layer, where the guiding core layer and the top cladding layer are disposed in a photosensitive housing waveguide, and a mode coupling region having a lateral taper of the guiding core layer and the top cladding layer disposed above a region where the InP substrate is at least partially removed to create an air-cladding, where a low-to-high refractive index contrast transition (RICT) InP-based waveguide device is established to minimize light leakage into the InP substrate.