Abstract: There is provided a gas solution supply apparatus capable of preventing bubbles from being generated in use at a point-of-use even if gas solution to be provided to a point-of-use has a high concentration. The gas solution supply apparatus 1 includes: a gas dissolving unit 4 that dissolves a source gas in a source liquid to produce a first gas solution; a first gas-liquid separator 10 that stores the first gas solution produced and produces a second gas solution through gas-liquid separation of the first gas solution; a pressure reducer 17 that depressurizes the second gas solution produced in the first gas-liquid separator 10; and a second gas-liquid separator 12 that stores the depressurized second gas solution and produces a third gas solution through gas-liquid separation of the second gas solution. The third gas solution is supplied to a point-of-use.

Abstract: To provide a laminated glass in which color shading of an optical member is reduced, and a method for producing it. A laminated glass comprising a first glass plate, a second glass plate facing the first glass plate, and between the first glass plate and the second glass plate, a light control member to which a power feeder is connected, a bonding portion and a sealing member, wherein the sealing member overlaps with at least a part of the periphery of the first glass plate, in a plan view, the bonding portion is in contact with the first glass plate, the second glass plate, and a first principal surface, a second principal surface and side surfaces of the light control member, and the bonding portion contains a curable transparent resin.

Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Abstract: To provide a laminated glass in which color shading of an optical member is reduced, and a method for producing it. A laminated glass comprising a first glass plate, a second glass plate facing the first glass plate, and between the first glass plate and the second glass plate, a light control member to which a power feeder is connected, a bonding portion and a sealing member, wherein the sealing member overlaps with at least a part of the periphery of the first glass plate, in a plan view, the bonding portion is in contact with the first glass plate, the second glass plate, and a first principal surface, a second principal surface and side surfaces of the light control member, and the bonding portion contains a curable transparent resin.

Abstract: To prevent a light control device from being scarred. A laminated glass 10 comprises a pair of glass plates 11 and 12, and a light control device 15 formed between the pair of glass plates 11 and 12, having a liquid crystal layer 153, a substrate 151, a conductive film 152 formed on one surface 151 S1 of the substrate 151 and a protective film 154 formed on the other surface 151S2 of the substrate 151. The liquid crystal layer has at least one member selected from the group consisting of guest-host liquid crystal, TN liquid crystal, PC liquid crystal, STN liquid crystal, ECB liquid crystal, OCB liquid crystal, IPS liquid crystal and VA liquid crystal. The protective film 154 has abrasion resistance higher than that of the substrate 151.

Abstract: A gas solution supply device 1 includes: a first gas-liquid separator 8 in which gas solution is stored; a second gas-liquid separator 16 provided at a stage subsequent to the first gas-liquid separator 8 and in which gas solution to be supplied to a use point is stored; an intermediate line 17 provided between the first gas-liquid separator 8 and the second gas-liquid separator 16; a pressure booster pump 18 provided on the intermediate line 17 and increases a pressure of gas solution being supplied from the first gas-liquid separator 8 to the second gas-liquid separator 16; a gas supply line 2 that supplies gas as a material of the gas solution; and a gas dissolving unit 20 provided on the intermediate line 17 and dissolves the gas supplied from the gas supply line 2 in the gas solution supplied from the first gas-liquid separator 8.

Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Abstract: The present vehicle includes a projection device installed in the vehicle; and a laminated glass configured to transmit a light beam emitted from the projection device to a vehicle exterior side. The laminated glass includes a vehicle-interior-side glass plate; a vehicle-exterior-side glass plate; an interlayer bonding the vehicle-interior-side glass plate and the vehicle-exterior-side glass plate; and a scattering layer arranged between the vehicle-exterior-side glass plate and the vehicle-interior-side glass plate, and in contact with the interlayer, the scattering layer being configured to be irradiated with the light beam. A relationship between visible light transmittance Tv (%) of the laminated glass and an angle of incidence ? (degrees) to the scattering layer of each ray included in the light beam incident on the scattering layer satisfies Formula (1) described in the description.

Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Abstract: According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution.

Abstract: According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution.