Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: Systems and methods for configuration and management of heater elements associated with sensor components are provided. A control component associated with the heater element obtains a plurality of inputs associated with the operation of the vehicle, such as location, operational status of components. The control component can utilize a body of information sources independent of any specific temperature or condition sensors on the sensor component to specify operational parameters of the heater element, such as a lookup table. The specified operational parameters can be selected with consideration of mitigation or discouraging the build-up of frozen precipitation on portions of the vehicle approximate to the sensor components. Additionally, the specified operational parameters can further be selected or specified with consideration of mitigation or discouraging of prolonged operation of the heater element resulting in such damages.

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: A multi-band antenna system is provided. The antenna system can be placed under and embedded within a glass exterior surface of a vehicle. Such an antenna system can include a capacitively coupled metallic element on or adjacent to the glass exterior surface, which can serve as both a parasitic element to enhance gain and as a heating element to melt snow and/or ice accumulation over the glass area that covers the antenna. In certain applications, the antenna's structure itself can be used as a heater to improve performance in adverse weather conditions while the heating elements are positioned away from the thermally sensitive electronics. The antenna system with integrated heating can include a spiral antenna.

Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.

Abstract: A system and method is provided for providing a cosmetic composition to a user. The system includes an apparatus configured to dispense at least one cosmetic composition into a output container; a user interface configured to receive information about the user; and circuitry configured to receive the information about the user and determine one or more cosmetic compositions to be dispensed into the output container based on the information about the user received at the user interface.

Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.

Abstract: A system and method is provided for providing a cosmetic composition to a user. The system includes an apparatus configured to dispense at least one cosmetic composition into a output container; a user interface configured to receive information about the user; and circuitry configured to receive the information about the user and determine one or more cosmetic compositions to be dispensed into the output container based on the information about the user received at the user interface.

Abstract: A system and method is provided for providing a cosmetic composition to a user. The system includes an apparatus configured to dispense at least one cosmetic composition into a output container; a user interface configured to receive information about the user; and circuitry configured to receive the information about the user and determine one or more cosmetic compositions to be dispensed into the output container based on the information about the user received at the user interface.

Abstract: An apparatus is provided for dispensing a cosmetic composition, including: a cartridge holder configured to hold at least one cartridge that stores a cosmetic composition, the cartridge holder being configured to move the cartridge to a predetermined location; a container receiving area configured to hold a output container beneath the predetermined location; circuitry configured to determine the cosmetic composition in the cartridge holder, control the cartridge holder to move the cartridge holder to the predetermined location based on the determination, and control the cartridge to dispense the cosmetic composition into the output container; and a mixer configured to hold the output container and subject the output container to a predetermined movement to cause contents of the output container to mix together.

Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.

Abstract: A mixer is provided for mixing a substance in a container. The mixer includes a motor; a frame configured to be controlled by the motor to rotate on an axis; a carrier disposed at a first end of the frame and configured to hold the container; a counterweight disposed at a second end of the frame opposite to the carrier, wherein the counterweight position relative to the axis is adjustable. The mixer may be a stand-alone unit, or it may be disposed in an apparatus for dispensing a cosmetic composition.

Abstract: A mixer is provided for mixing a substance in a container. The mixer includes a motor; a frame configured to be controlled by the motor to rotate on an axis; a carrier disposed at a first end of the frame and configured to hold the container; a counterweight disposed at a second end of the frame opposite to the carrier, wherein the counterweight position relative to the axis is adjustable. The mixer may be a stand-alone unit, or it may be disposed in an apparatus for dispensing a cosmetic composition.

Abstract: An apparatus is provided for dispensing a cosmetic composition, including: a cartridge holder configured to hold at least one cartridge that stores a cosmetic composition, the cartridge holder being configured to move the cartridge to a predetermined location; a container receiving area configured to hold a output container beneath the predetermined location; circuitry configured to determine the cosmetic composition in the cartridge holder, control the cartridge holder to move the cartridge holder to the predetermined location based on the determination, and control the cartridge to dispense the cosmetic composition into the output container; and a mixer configured to hold the output container and subject the output container to a predetermined movement to cause contents of the output container to mix together.