Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.