Abstract: An electrostatic chuck heater is such that a sheet heater formed by embedding a heater wire in a resin sheet is disposed between an electrostatic chuck and a support pedestal. The heater wires are provided one for each of many zones of the resin sheet, and are composed of copper wires routed unicursally from their first ends to their second ends so as to extend throughout the zones.

Abstract: A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 famed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided, and through holes 755 penetrating the contact opposed lands 754, the support layer 751, and contacts 753. Solder bonding members 756 cover surfaces of contact opposed lands 754 and are filled inside through holes 755 and in a bonding space C.

Abstract: Object information representing a honeycomb structure with a plurality of meshes is obtained, and an inner-wall-surface heat transfer coefficient hs, i.e., a heat transfer coefficient between an inner wall surface of a cell and a fluid, is derived as follows. First, one of the meshes as a target for derivation of the inner-wall-surface heat transfer coefficient hs is set (S200), and a dimensionless coordinate X* is derived on the basis of position information (X-coordinate) of the set mesh and fluid state information (S210). An inner-wall-surface dimensionless heat transfer coefficient Nus corresponding to the derived dimensionless coordinate X* is then derived on the basis of the inner-wall-surface dimensionless correspondence information (S220 to S250). The inner-wall-surface heat transfer coefficient hs in the mesh set as the derivation target is then derived on the basis of the derived inner-wall-surface dimensionless heat transfer coefficient Nus (S260).

Abstract: A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 formed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided. In addition to base surfaces 461 opposed to the contacts 753, the heater lands 46 respectively include extended surfaces 462 opposed to imaginary extended portions 753b imaginarily extended ahead from the contacts 753. A solder bonding member 756 covers surfaces of the contact opposed lands 754, a distal end surface of the connection FPC 75, and the extended surfaces 462 of the heater lands 46, and is filled in a bonding space C.

Abstract: An electrostatic chuck heater is such that a sheet heater formed by embedding a heater wire in a resin sheet is disposed between an electrostatic chuck and a support pedestal. The heater wires are provided one for each of many zones of the resin sheet, and are composed of copper wires routed unicursally from their first ends to their second ends so as to extend throughout the zones.

Abstract: A connection FPC 75 includes a plurality of metal wires 750 between a support layer 751 and a covering layer 752, and an exposed region including contacts 753 serving as end portions of the metal wires 750 is exposed from the covering layer 752. A bending-position guide 760 is provided on the surface of the support layer 751 opposite from the surface on which the metal wires 750 are provided. An edge 760a of the bending-position guide 760 serves as a bending line along which the connection FPC 75 is bent and is disposed in a covering-layer projection area E where the covering layer 752 is projected on the support layer 751. The connection FPC 75 is bent at portions of the metal wires 750 covered with the covering layer 752, that is, at reinforced portions.

Abstract: A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 formed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided. In addition to base surfaces 461 opposed to the contacts 753, the heater lands 46 respectively include extended surfaces 462 opposed to imaginary extended portions 753b imaginarily extended ahead from the contacts 753. A solder bonding member 756 covers surfaces of the contact opposed lands 754, a distal end surface of the connection FPC 75, and the extended surfaces 462 of the heater lands 46, and is filled in a bonding space C.

Abstract: A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 famed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided, and through holes 755 penetrating the contact opposed lands 754, the support layer 751, and contacts 753. Solder bonding members 756 cover surfaces of contact opposed lands 754 and are filled inside through holes 755 and in a bonding space C.

Abstract: Object information representing a honeycomb structure with a plurality of meshes is obtained, and an inner-wall-surface heat transfer coefficient hs, i.e., a heat transfer coefficient between an inner wall surface of a cell and a fluid, is derived as follows. First, one of the meshes as a target for derivation of the inner-wall-surface heat transfer coefficient hs is set (S200), and a dimensionless coordinate X* is derived on the basis of position information (X-coordinate) of the set mesh and fluid state information (S210). An inner-wall-surface dimensionless heat transfer coefficient Nus corresponding to the derived dimensionless coordinate X* is then derived on the basis of the inner-wall-surface dimensionless correspondence information (S220 to S250). The inner-wall-surface heat transfer coefficient hs in the mesh set as the derivation target is then derived on the basis of the derived inner-wall-surface dimensionless heat transfer coefficient Nus (S260).