Patents by Inventor Risto Mutikainen

Risto Mutikainen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10384929
    Abstract: A sensor device and a method for manufacturing the sensor device. The sensor device is equipped with an impact element that includes an inner part of dielectric bulk material and an outer part of diamond-like coating material. The inner part is made to be lower at the edges than in the middle, and the outer part is formed of a diamond-like coating layer that covers the inner part. The DLC coated impact element is mechanically more robust than the rectangular prior art structures. Furthermore, the tapered form of the impact element improves conductivity of the DLC coating such that discharge of static buildup in the impact element is effectively enabled.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 20, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Risto Mutikainen, Juha Lahdenperä
  • Publication number: 20190002276
    Abstract: A sensor device and a method for manufacturing the sensor device. The sensor device is equipped with an impact element that includes an inner part of dielectric bulk material and an outer part of diamond-like coating material. The inner part is made to be lower at the edges than in the middle, and the outer part is formed of a diamond-like coating layer that covers the inner part. The DLC coated impact element is mechanically more robust than the rectangular prior art structures. Furthermore, the tapered form of the impact element improves conductivity of the DLC coating such that discharge of static buildup in the impact element is effectively enabled.
    Type: Application
    Filed: January 13, 2017
    Publication date: January 3, 2019
    Inventors: Risto MUTIKAINEN, Juha LAHDENPERÄ
  • Patent number: 7555950
    Abstract: The present invention relates to measuring devices for use in physical measuring, and in particular to capacitive sensors. In the sensor according to the invention, the shape of the stationary electrode (3), (4), (12), (17-20), (27-28) is stepped. Through the invention, a method for manufacturing a capacitive sensor with improved linearity is achieved, as well as a capacitive sensor suitable for use particularly in small capacitive sensor solutions.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: July 7, 2009
    Assignee: VTI Technologies Oy
    Inventors: Jaakko Ruohio, Risto Mutikainen
  • Patent number: 7302857
    Abstract: A method of manufacturing a sensor including forming an insulating layer on top of a conductive substrate, and forming a conducting electrode on top of the insulating layer. Further, the insulating layer is formed to include support areas formed at edges of the conducting electrode and a partial area formed under the conducting electrode, and a thickness (d2) of the partial area of the insulating layer is less than a thickness (d1) of the support areas of the insulating area.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: December 4, 2007
    Assignee: VTI Technologies Oy
    Inventors: Heikki Kuisma, Juha Lahdenperä, Risto Mutikainen
  • Publication number: 20060213269
    Abstract: The present invention relates to measuring devices for use in physical measuring, and in particular to capacitive sensors. In the sensor according to the invention, the shape of the stationary electrode (3), (4), (12), (17-20), (27-28) is stepped. By means of the invention, a method for manufacturing a capacitive sensor with improved linearity is achieved, as well as a capacitive sensor suitable for use particularly in small capacitive sensor solutions.
    Type: Application
    Filed: September 23, 2005
    Publication date: September 28, 2006
    Inventors: Jaakko Ruohio, Risto Mutikainen
  • Publication number: 20060046329
    Abstract: The invention relates to a method for manufacturing a silicon sensor structure and a silicon sensor. According to the method, into a single-crystal silicon wafer (10) is formed by etched openings at least one spring element configuration (7) and at least one seismic mass (8) connected to said spring element configuration (7). According to the invention, the openings and trenches (8) extending through the depth of the silicon wafer are fabricated by dry etch methods, and the etch process used for controlling the spring constant of the spring element configuration (7) is based on wet etch methods.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 2, 2006
    Inventors: Heikki Kuisma, Juha Lahdenpera, Risto Mutikainen
  • Patent number: 6998059
    Abstract: The invention relates to a method for manufacturing a silicon sensor structure and a silicon sensor. According to the method, into a single-crystal silicon wafer (10) is formed by etched opening at least one spring element configuration (7) and at least one seismic mass (8) connected to said spring element configuration (7). According to the invention, the openings and trenches (8) extending through the depth of the silicon wafer are fabricated by dry etch methods, and the etch process used for controlling the spring constant of the spring element configuration (7) is based on wet etch methods.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: February 14, 2006
    Assignee: VTI Technologies Oy
    Inventors: Heikki Kuisma, Juha Lahdenperä, Risto Mutikainen
  • Patent number: 6938485
    Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode (4) and a stationary electrode (5), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.
    Type: Grant
    Filed: February 10, 2004
    Date of Patent: September 6, 2005
    Assignee: VTI Technologies Oy
    Inventors: Heikki Kuisma, Juha Lahdenperä, Risto Mutikainen
  • Publication number: 20050105245
    Abstract: This publication discloses a method for creating a sensor construction. According to the method, on top of a conducting substrate (2), an insulating layer (5) is formed and connected to the micromechanical construction. According to the invention, the insulating layer (5) is formed to be thicker (14) in the support area (16) than in the other areas, or thinner (13) in the area of the electrode (8) than in the support area (16) of the sensor.
    Type: Application
    Filed: February 10, 2003
    Publication date: May 19, 2005
    Applicant: VTI Technologies Oy
    Inventors: Heikki Kuisma, Juha Lahdenpera, Risto Mutikainen
  • Publication number: 20040226374
    Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode (4) and a stationary electrode (5), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.
    Type: Application
    Filed: February 10, 2004
    Publication date: November 18, 2004
    Inventors: Heikki Kuisma, Juha Lahdenpera, Risto Mutikainen