Patents by Inventor Risto Tuominen
Risto Tuominen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11792941Abstract: The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.Type: GrantFiled: August 30, 2021Date of Patent: October 17, 2023Assignee: IMBERATEK, LLCInventors: Risto Tuominen, Antti Iihola, Petteri Palm
-
Publication number: 20230225055Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: ApplicationFiled: March 16, 2023Publication date: July 13, 2023Inventors: Risto TUOMINEN, Petteri PALM
-
Publication number: 20210392752Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.Type: ApplicationFiled: August 30, 2021Publication date: December 16, 2021Inventors: Risto Tuominen, Antti Iihola, Petteri Palm
-
Publication number: 20210321520Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Inventors: Risto Tuominen, Petteri Palm
-
Patent number: 11134572Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.Type: GrantFiled: November 18, 2016Date of Patent: September 28, 2021Assignee: IMBERATEK, LLCInventors: Risto Tuominen, Antti Iihola, Petteri Palm
-
Patent number: 11071207Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: GrantFiled: August 28, 2020Date of Patent: July 20, 2021Assignee: IMBERATEK, LLCInventors: Risto Tuominen, Petteri Palm
-
Publication number: 20210037654Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: ApplicationFiled: August 28, 2020Publication date: February 4, 2021Inventors: Risto Tuominen, Petteri Palm
-
Patent number: 10765006Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: GrantFiled: August 20, 2018Date of Patent: September 1, 2020Assignee: IMBERATEK, LLCInventors: Risto Tuominen, Petteri Palm
-
Patent number: 10470346Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.Type: GrantFiled: May 28, 2018Date of Patent: November 5, 2019Assignee: GE Embedded Electronics OyInventor: Risto Tuominen
-
Publication number: 20180376597Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: ApplicationFiled: August 20, 2018Publication date: December 27, 2018Inventors: Risto Tuominen, Petteri Palm
-
Publication number: 20180352689Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.Type: ApplicationFiled: May 28, 2018Publication date: December 6, 2018Inventor: Risto Tuominen
-
Patent number: 10085347Abstract: Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.Type: GrantFiled: March 18, 2015Date of Patent: September 25, 2018Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm, Antti Iihola
-
Patent number: 10085345Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: GrantFiled: August 25, 2014Date of Patent: September 25, 2018Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm
-
Patent number: 10010019Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.Type: GrantFiled: February 16, 2015Date of Patent: June 26, 2018Assignee: GE Embedded Electronics OyInventor: Risto Tuominen
-
Patent number: 9999136Abstract: The present invention concerns an electronic module with at least one component embedded in insulating material.Type: GrantFiled: December 15, 2014Date of Patent: June 12, 2018Assignee: GE Embedded Electronics OyInventor: Risto Tuominen
-
Patent number: 9883587Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.Type: GrantFiled: March 30, 2016Date of Patent: January 30, 2018Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Risto Tuominen, Antti Iihola
-
Publication number: 20170271288Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.Type: ApplicationFiled: June 2, 2017Publication date: September 21, 2017Inventors: Antti Iihola, Risto Tuominen
-
Patent number: 9691724Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.Type: GrantFiled: January 23, 2014Date of Patent: June 27, 2017Assignee: GE Embedded Electronics OyInventors: Antti Iihola, Risto Tuominen
-
Patent number: 9622354Abstract: A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.Type: GrantFiled: November 11, 2013Date of Patent: April 11, 2017Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Antti Iihola, Petteri Palm
-
Publication number: 20170071061Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.Type: ApplicationFiled: November 18, 2016Publication date: March 9, 2017Inventors: Risto Tuominen, Antti Iihola, Petteri Palm