Patents by Inventor Rita Mohanty
Rita Mohanty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10010900Abstract: A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and two deposition heads coupled to the gantry. Each deposition head includes a needle, with the deposition heads being movable over the support by movement of the gantry. The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry, with the needle cleaner assembly being configured to clean needles of the deposition heads. The material deposition system further includes a controller configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.Type: GrantFiled: September 28, 2016Date of Patent: July 3, 2018Assignee: Illinois Tool Works Inc.Inventors: Rita Mohanty, Robert W. Tracy, Scott A. Reid
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Publication number: 20170014847Abstract: A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and two deposition heads coupled to the gantry. Each deposition head includes a needle, with the deposition heads being movable over the support by movement of the gantry. The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry, with the needle cleaner assembly being configured to clean needles of the deposition heads. The material deposition system further includes a controller configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.Type: ApplicationFiled: September 28, 2016Publication date: January 19, 2017Inventors: Rita Mohanty, Robert W. Tracy, Scott A. Reid
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Patent number: 9475078Abstract: A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and two deposition heads coupled to the gantry. Each deposition head includes a needle, with the deposition heads being movable over the support by movement of the gantry. The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry, with the needle cleaner assembly being configured to clean needles of the deposition heads. The material deposition system further includes a controller configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.Type: GrantFiled: October 29, 2012Date of Patent: October 25, 2016Assignee: Illinois Tool Works Inc.Inventors: Rita Mohanty, Robert W. Tracy, Scott A. Reid
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Patent number: 9039146Abstract: A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity.Type: GrantFiled: October 30, 2012Date of Patent: May 26, 2015Assignee: ILLINOIS TOOL WORKS INC.Inventors: Kenneth C. Crouch, Kui-Chiu Kwok, Robert W. Tracy, Rita Mohanty, Thomas J. Karlinski, Scott A. Reid
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Patent number: 9010910Abstract: A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity.Type: GrantFiled: November 10, 2014Date of Patent: April 21, 2015Assignee: Illinois Tool Works Inc.Inventors: Kenneth C. Crouch, Kui-Chiu Kwok, Robert W. Tracy, Rita Mohanty, Thomas J. Karlinski, Scott A. Reid
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Publication number: 20150064345Abstract: A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity.Type: ApplicationFiled: November 10, 2014Publication date: March 5, 2015Inventors: Kenneth C. Crouch, Kui-Chiu Kwok, Robert W. Tracy, Rita Mohanty, Thomas J. Karlinski, Scott A. Reid
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Publication number: 20140120241Abstract: A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and two deposition heads coupled to the gantry. Each deposition head includes a needle, with the deposition heads being movable over the support by movement of the gantry. The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry, with the needle cleaner assembly being configured to clean needles of the deposition heads. The material deposition system further includes a controller configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.Type: ApplicationFiled: October 29, 2012Publication date: May 1, 2014Inventors: Rita Mohanty, Robert W. Tracy, Scott A. Reid
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Publication number: 20130177702Abstract: A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity.Type: ApplicationFiled: October 30, 2012Publication date: July 11, 2013Inventors: Kenneth C. Crouch, Kui-Chiu Kwok, Robert W. Tracy, Rita Mohanty, Thomas J. Karlinski, Scott A. Reid
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Patent number: 8128720Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: GrantFiled: July 18, 2011Date of Patent: March 6, 2012Assignee: Illinois Tool Works Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Patent number: 8110015Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: GrantFiled: May 30, 2007Date of Patent: February 7, 2012Assignee: Illinois Tool Works, Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Publication number: 20110272451Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: ApplicationFiled: July 18, 2011Publication date: November 10, 2011Applicant: ILLINOIS TOOL WORKS INC.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Patent number: 7981178Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: GrantFiled: May 30, 2007Date of Patent: July 19, 2011Assignee: Illinois Tool Works, Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Publication number: 20080295686Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: ApplicationFiled: May 30, 2007Publication date: December 4, 2008Applicant: Illinois Tool Works Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Publication number: 20030019735Abstract: Methods are provided including (a) bonding separate conductive areas of an electrical component to a substrate using a conductive adhesive; and (b) bonding an area of the electrical component lying between the conductive areas to the substrate using a non-conductive adhesive.Type: ApplicationFiled: July 30, 2001Publication date: January 30, 2003Inventors: David Malcolm Howie, Rita Mohanty