Abstract: A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured product with an excellent heat resistance, is provided. The composition comprises 100 parts by weight of (A) an epoxide having more than one epoxy group on average in the molecule, and 1 to 40 parts by weight of (B) a curing compound which is prepared by reacting with heating (a) aminoalkylimidazole of the general formula: (b) an amine having two nitrogen atoms with one or two active hydrogen atoms and having at least one cyclic structure group in the molecule therein, (c) urea, and (d) a diepoxide having two epoxy groups on average in the molecule.

Abstract: A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured product with an excellent heat resistance, is provided. The composition comprises 100 parts by weight of (A) an epoxide having more than one epoxy group on average in the molecule, and 1 to 40 parts by weight of (B) a curing compound which is prepared by reacting with heating (a) aminoalkylimidazole of the general formula: (b) an amine having two nitrogen atoms with one or two active hydrogen atoms and having at least one cyclic structure group in the molecule therein, (c) urea, and (d) a diepoxide having two epoxy groups on average in the molecule.

Abstract: A one-pack type epoxide composition which has excellent storage stability and which can be rapidly cured at relatively low temperature is provided. It comprises as effective components (A) at least one epoxide having more than one, preferably more than 1.5 epoxy groups per a molecule, and (B) a curing agent prepared by heating and reacting (a) at least one N,N-dialkylaminoalkylamine, (b) at least one amine having one or two nitrogen atoms with active hydrogen and having a ring structure in its molecule, (c) at least one diisocyanate, or (C) a curing agent prepared by heating and reacting (a) at least one N,N-dialkylaminoalkylamine, (b) at least one amine having one or two nitrogen atoms with active hydrogen and having a ring structure in its molecule, (d) at least one epoxide having one or more epoxy groups in a molecule, and (c) at least on diisocyanate.

Abstract: A one-pack type epoxy resin composition which can be easily handled and has excellent curing characteristics is provided by blending at least one epoxy resin having more than one epoxy groups in a molecule with a curing agent obtained by reacting at least one diamine compound, at least one N,N-dialkylaminoalkylamine, at least one epoxy resin having more than one epoxy groups in a molecule, urea, and as an optional component, at least one monoamine compound.