Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof.

Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.

Abstract: It is an object of the present invention to provide a curable composition which provides a cured product excellent in low warpage properties and long-term electrical insulation reliability and causes little bleeding during screen printing. The present invention is a curable composition comprising the following components (a) to (e): a component (a): polyurethane having a functional group capable of curing reaction and a carbonate bond, a component (b): ?-butyrolactone, a component (c): diethylene glycol diethyl ether, a component (d): inorganic fine particles and/or organic fine particles, and a component (e): a compound having two or more epoxy groups in one molecule.

Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.

Abstract: Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.

Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof.

Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.

Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a) that includes an organic residue derived from a dimer diol, a polyisocyanate (b) and a carboxyl group-containing polyol (c).

Abstract: It is an object of the present invention to provide a curable composition which provides a cured product excellent in low warpage properties and long-term electrical insulation reliability and causes little bleeding during screen printing. The present invention is a curable composition comprising the following components (a) to (e): a component (a): polyurethane having a functional group capable of curing reaction and a carbonate bond, a component (b): ?-butyrolactone, a component (c): diethylene glycol diethyl ether, a component (d): inorganic fine particles and/or organic fine particles, and a component (e): a compound having two or more epoxy groups in one molecule.

Abstract: The present invention provides a thermosetting ink composition having excellent balance concerning screen printability capable of preventing oozing and bleeding at the time of screen printing, electric insulating reliability and adhesion with an objective for coating. The thermosetting ink composition of the invention comprises a thermosetting resin (A) having a value “a” of less than 0.60 in the following formula (1) showing the relationship between the intrinsic viscosity [?] and the absolute molecular weight M of the resin: [?]=K×Ma??(1) wherein K is a constant number. Since the thermosetting ink composition can prevent oozing and bleeding at the time of screen printing and an excessive amount of a filler is not used for improving the printability, it can form excellent solder resists and other protective films at low coat without decreasing the electric insulating reliability and adhesion with an objective for coating.

Abstract: Disclosed is a carboxyl group-containing polyurethane containing a structure derived from a polycarbonate diol (B), the polycarbonate diol (B) having: (i) a number-average molecular weight of 500 to 50,000; (ii) an alkylene group of 8 to 18 carbon atoms in its structure; and (iii) hydroxyl groups at both ends. The carboxyl group-containing polyurethane is suitable as materials of cured products that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.

Abstract: A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).

Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.

Abstract: A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).

Abstract: Disclosed is a carboxyl group-containing polyurethane containing a structure derived from a polycarbonate diol (B), the polycarbonate diol (B) having: (i) a number-average molecular weight of 500 to 50,000; (ii) an alkylene group of 8 to 18 carbon atoms in its structure; and (iii) hydroxyl groups at both ends. The carboxyl group-containing polyurethane is suitable as materials of cured products that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.