Patents by Inventor Ritsuko Shidei

Ritsuko Shidei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5906712
    Abstract: The present invention provides a process for producing a fiber reinforced composite which contains the reinforcing fibers uniformly dispersed therein and therefore has uniformity of strength. The process comprises;preparing an aqueous slurry which comprises reinforcing fibers, water-soluble organic polymers A charged in water and particulate organic polymers,adding thereto water-soluble organic polymers B charged opposite to said organic polymers A in water to flocculate the solid components in said aqueous slurry, andthen removing aqueous medium and molding.
    Type: Grant
    Filed: June 20, 1994
    Date of Patent: May 25, 1999
    Assignee: Unitika Ltd.
    Inventors: Keiichi Asami, Kiyotaka Nakanishi, Hideki Takahashi, Ritsuko Shidei, Azusa Yamagata, Yoshiaki Echigo
  • Patent number: 4778695
    Abstract: A resole resin in the form of microspherical particles whose surfaces are partly or entirely covered with a coating of a substantially water-insoluble inorganic salt and which are not larger than 500 .mu.m in size, and a process for producing such resole resin. The resole resin comprises solid particles that are highly heat reactive and can be stored in a stable manner for a prolonged period. The resin particles can be used with good results in all fields of applications (e.g., moldings, laminations and binders) where conventional phenolic resins are used.
    Type: Grant
    Filed: October 3, 1986
    Date of Patent: October 18, 1988
    Assignee: Unitika Ltd.
    Inventors: Yoshiaki Echigo, Mutsunori Yamao, Yoshiyuki Suematu, Tadashi Ishikura, Keiichi Asami, Ritsuko Shidei
  • Patent number: 4748214
    Abstract: A process for producing microspherical cured phenolic resin particles having a particle diameter of not more than about 100 .mu.m, which comprises reacting a novolak resin, a phenol and an aldehyde in an aqueous medium in the presence of a basic catalyst and an emulsion stabilizer. Novel microspherical cured phenolic resin particles are produced by this process. The resin particles have excellent impact strength and mechanical properties, a sharp particle size distribution, and a low secondary agglomerate content, and because of these properties, are useful as an excellent modifier or filler for various plastics and rubbers.
    Type: Grant
    Filed: May 13, 1986
    Date of Patent: May 31, 1988
    Assignee: Unitika Ltd.
    Inventors: Keiichi Asami, Yoshiaki Echigo, Mutsunori Yamao, Yoshiyuki Suematu, Tadashi Ishikura, Ritsuko Shidei
  • Patent number: 4640971
    Abstract: A resole resin in the form of microspherical particles whose surfaces are partly or entirely covered with a coating of a substantially water-insoluble inorganic salt and which are not larger than 500 .mu.m in size, and a process for producing such resole resin. The resole resin comprises solid particles that are highly heat reactive and can be stored in a stable manner for a prolonged period. The resin particles can be used with good results in all fields of applications (e.g., moldings, laminations and binders) where conventional phenolic resins are used.
    Type: Grant
    Filed: July 17, 1985
    Date of Patent: February 3, 1987
    Assignee: Unitika Ltd.
    Inventors: Yoshiaki Echigo, Mutsunori Yamao, Yoshiyuki Suematu, Tadashi Ishikura, Keiichi Asami, Ritsuko Shidei