Abstract: The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200° C. to 450° C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.

Abstract: In an aspect, the present disclosure relates to a polyamide solution comprising an aromatic polyamide and a solvent, wherein a Young's modulus of at least one direction of a cast film produced by casting the polyamide solution on a glass plate is 3.0 GPa or more, and a tensile strength of the cast film is 100 MPa or more and 250 MPa or less. In another aspect, the present disclosure relates to a polyamide solution comprising an aromatic polyamide and a solvent, wherein a Young's modulus of at least one direction of a cast film produced by casting the polyamide solution on a glass plate is 3.0 GPa or more, and an aromatic polyamide of the polyamide solution has a constitutional unit represented by following general formulae (I) and (II).

Abstract: A cover member includes a base material having a film shape and containing an amorphous aromatic polyamide. Further, it is preferred that the aromatic polyamide contains a carboxyl group. Furthermore, it is preferred that the aromatic polyamide contains a rigid structure in an amount of 85 mol % or more. Moreover, it is preferred that a tensile elastic modulus of the base material is 4 GPa or more. This makes it possible to provide a cover member having a good flatness keeping property and excellent long-term durability, and an electronic device provided with such a cover member and having excellent reliability.

Abstract: The present disclosure, in one aspect, relates to a polyamide solution which can suppress the yellowness. The present disclosure, in one or a plurality of embodiments, relates to a polyamide solution comprising an aromatic polyamide and a solvent, the aromatic polyamide comprising a constitutional unit having one or more free carboxyl groups and having an aromatic ring structure and an alicyclic structure in the main chain. Further, the present disclosure, in one aspect, relates to a laminated composite material, comprising a glass plate and a polyamide resin layer; the polyamide resin layer laminated onto one surface of the glass plate, the polyamide resin layer having yellowness (JIS K7373) of 2.4 or less; and the polyamide resin layer obtained by applying the solution onto the glass plate.

Abstract: In one or a plurality of embodiments, a process for manufacturing polyamide without using PrO (propylene oxide) in synthesis is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (a) to (c): (a) reacting diacid dichloride monomer with at least two kinds of diamine monomers in a solvent so as to generate polyamide; and (b) removing hydrochloric acid physically out of a reaction system, the hydrochloric acid being generated during the reaction in the step (a); or (c) adding a trapping reagent capable of trapping hydrochloric acid, at any time at least before the step (a), at the same time of starting the step (a), or during the step (a), wherein at least one of the diamine monomers is a diamine monomer containing a carboxyl group, and the trapping reagent does not include propylene oxide.

Abstract: In one aspect, a polymer film having improved mechanical properties is provided. In one aspect, a polymer solution containing a solvent and a polymer that contains either a structural unit having a benzoxazole precursor structure or a structural unit having a benzoxazole structure is provided.

Abstract: In one or a plurality of embodiments, a process for manufacturing polyamide, with a reduced use of an amide-based solvent in synthesis, is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (1) to (3): (1) dissolving diamine in a non-amide-based organic solvent or a non-amide-based organic solvent containing 10 mass% or less of an amide-based organic solvent; (2) adding diacid dichloride to a solution obtained in the step (1) and reacting the diamine with the diacid dichloride so as to generate polyamide; and (3) adding a trapping reagent capable of trapping hydrochloric acid.

Abstract: In one or a plurality of embodiments, a process for manufacturing polyamide, with a reduced use of an amide-based solvent in synthesis, is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (a) to (c): (a) dissolving diacid dichloride in a non-amide-based organic solvent; (b) adding diamine to a solution obtained in the step (a) and reacting the diacid dichloride with the diamine so as to generate polyamide; and (c) adding a trapping reagent capable of trapping hydrochloric acid, at any time at least before the step (b), at the same time of starting the step (b), or during the step (b).

Abstract: This disclosure, viewed from one aspect, relates to a method for producing a sensor element, including the following steps (A) and (B): (A) applying a polyamide solution onto a base to form a polyamide film on the base; and (B) forming a sensor element on the surface of the polyamide film, wherein the base or the surface of the base is composed of glass or silicon wafer, wherein a polyamide of the polyamide solution has a constitutional unit represented by the following general formulae (I) and (II):

Abstract: In an aspect, the present disclosure relates to a polyamide solution including aromatic polyamide and a solvent. A dimension change gap between a cast film of the polyamide solution and the cast film after being subjected to a heat treatment is not more than a predetermined value. In another aspect, the present disclosure relates to a method for manufacturing a display element, an optical element, an illumination element or a sensor element, including a step of forming a polyamide film by using the polyamide solution.

Abstract: Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a polymer and a solvent dissolving the polymer. The resin composition is used to form a layer, and when refractive indexes of the layer along two perpendicular in-plane directions thereof are respectively defined as “Nx” and “Ny” and a refractive index of the layer along a thickness direction thereof is defined as “Nz”, Nx, Ny and Nz satisfy a relationship of “(Nx+Ny)/2?Nz”>0.01. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.

Abstract: Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device including a transparent resin film having an excellent display property, a method of manufacturing such a resin composition and a method of manufacturing the electronic device using such a substrate and the electronic device. The resin composition of the present invention contains an aromatic polyamide, an aromatic multifunctional compound having two or more functional groups including a carboxyl group or an amino group, and a solvent dissolving the aromatic polyamide.

Abstract: The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200° C. to 450° C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.

Abstract: This disclosure, in one or plurality of embodiments, relates to a solution of polyamide from which a cast film with low CTE and Rth can be achieved. This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; inorganic filler; and a solvent. This disclosure, viewed from one aspect, relates to a laminated composite material, comprising a base, and a polyamide resin layer: wherein the polyamide resin layer is laminated to one surface of the base; and wherein the polyamide resin layer is obtained or obtainable by applying a polyamide solution comprising an aromatic polyamide, an inorganic filler and a solvent onto the base.

Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; and a solvent; wherein elastic modulus at 30.0° C. of a cast film formed by applying the solution onto a glass plate is 5.0 GPa or less, and coefficient of thermal expansion (CTE) of the cast film is more than 30 ppm/K, and wherein the aromatic copolyamide comprises at least two repeat units, and at least one of the repeat units has one or more free carboxyl groups.

Abstract: This disclosure, in one aspect, relates to a solution of polyamide including an aromatic polyamide and an amphiphilic solvent. This disclosure, in another aspect, relates to a solution of polyamide including an aromatic polyamide, an amphiphilic solvent, and an aprotic solvent. This disclosure, in another aspect, relates to a solution of aromatic polyamide for producing a display element, an optical element or an illumination element.

Abstract: This disclosure, viewed from one aspect, relates to a laminated composite material, including a glass plate and an organic resin layer. The organic resin layer is laminated on one surface of the glass plate, the organic resin is a polyamide resin, the rate of mass change of the polyamide resin from 300° C. to 400° C. measured by thermo gravimetry (TG) is 3.0% or less, and the glass transition temperature of the polyamide resin is 300° C. or more.

Abstract: This disclosure, viewed from one aspect, this disclosure relates to a solution of polyamide comprising: an aromatic polyamide, a silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.

Abstract: The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant.

Abstract: The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant.