Patents by Inventor Ritu Bawa

Ritu Bawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METHODS FOR MANUFACTURING OR OPERATING COOLING SYS-TEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES
    Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Vapor chamber and means of attachment
    Patent number: 11573055
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: February 7, 2023
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
    Publication number: 20220225536
    Abstract: Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Inventors: Arunpandi R., Kathiravan D, Triplicane Gopikrishnan Babu, Doddi Raghavendra, Ritu Bawa, Bijendra Singh
  • HINGE ASSEMBLY AND GUIDE ASSEMBLY FOR ELECTRONIC DEVICES USING A HEAT CARRYING MEMBER
    Publication number: 20210103317
    Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
    Type: Application
    Filed: November 21, 2020
    Publication date: April 8, 2021
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Samarth Alva, Bhavaneeswaran Anbalagan, Triplicane Gopikrishnan Babu, Prasanna Pichumani, Raghavendra Doddi, Sudheera Sudhakar, Ritu Bawa
  • VAPOR CHAMBER AND MEANS OF ATTACHMENT
    Publication number: 20200132391
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur