Patents by Inventor River (Guanghua) Huang

River (Guanghua) Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency interconnection for circuits
    Patent number: 6838953
    Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: January 4, 2005
    Assignee: Hei, Inc.
    Inventors: River (Guanghua) Huang, Parker Chandler
  • High-frequency interconnection for circuits
    Publication number: 20020190812
    Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
    Type: Application
    Filed: August 26, 2002
    Publication date: December 19, 2002
    Applicant: HEI, Inc.
    Inventors: River (Guanghua) Huang, Parker Chandler
  • High-frequency interconnection for circuits
    Patent number: 6469592
    Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: October 22, 2002
    Assignee: Hei, Inc.
    Inventors: River Guanghua Huang, Parker Chandler
  • High-frequency interconnection for circuits
    Publication number: 20020008598
    Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
    Type: Application
    Filed: September 24, 2001
    Publication date: January 24, 2002
    Applicant: HEI, Inc.
    Inventors: River Guanghua Huang, Parker Chandler
  • Interconnection device
    Patent number: 6294966
    Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.
    Type: Grant
    Filed: December 31, 1999
    Date of Patent: September 25, 2001
    Assignee: HEI, Inc.
    Inventors: River Guanghua Huang, Parker Chandler