Patents by Inventor Rizza Lee Saga Cizek
Rizza Lee Saga Cizek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9947641Abstract: A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.Type: GrantFiled: July 22, 2016Date of Patent: April 17, 2018Assignee: Invensas CorporationInventors: Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar
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Patent number: 9893033Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.Type: GrantFiled: April 12, 2016Date of Patent: February 13, 2018Assignee: Invensas CorporationInventors: Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni
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Publication number: 20160329308Abstract: A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.Type: ApplicationFiled: July 22, 2016Publication date: November 10, 2016Applicant: Invensas CorporationInventors: Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar
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Patent number: 9412714Abstract: A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.Type: GrantFiled: May 30, 2014Date of Patent: August 9, 2016Assignee: Invensas CorporationInventors: Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar
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Publication number: 20160225739Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.Type: ApplicationFiled: April 12, 2016Publication date: August 4, 2016Inventors: Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni
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Publication number: 20150348928Abstract: A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.Type: ApplicationFiled: May 30, 2014Publication date: December 3, 2015Applicant: INVENSAS CORPORATIONInventors: Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar
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Patent number: 9087815Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Tensioning the wire using the bonding tool causes the wire to break and define an end. The lead then extends from the metal surface to the end.Type: GrantFiled: November 12, 2013Date of Patent: July 21, 2015Assignee: Invensas CorporationInventors: Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni
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Patent number: 9082753Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibits a sign of the torsional force applied thereto.Type: GrantFiled: June 6, 2014Date of Patent: July 14, 2015Assignee: Invensas CorporationInventors: Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni
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Publication number: 20150129647Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibits a sign of the torsional force applied thereto.Type: ApplicationFiled: June 6, 2014Publication date: May 14, 2015Inventors: Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni
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Publication number: 20150129646Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Tensioning the wire using the bonding tool causes the wire to break and define an end. The lead then extends from the metal surface to the end.Type: ApplicationFiled: November 12, 2013Publication date: May 14, 2015Applicant: Invensas CorporationInventors: Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni