Abstract: A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.

Abstract: A wedge-shaped printed wiring assembly is inserted into a chassis having guide rails for coarse positioning of the unit the final alignment being accomplished with male and female pins on the connector. Slotted air openings at the entrance and exit of the printed wiring assembly are matched to corresponding openings through the seal. The seal surfaces are tapered a nominal 1.5 degrees top to bottom to facilitate insertion of the printed wiring assembly into the chassis which causes the taper surfaces to come together and force the seal to deflect uniformly and provide a tight interface across the entire surface. The seal material is preferably polyether urethane or a like material.

Abstract: Two waveguide structures are coupled by connector members that are slideably engaged to one waveguide and adaptable to fixed engagement with the other. Tapered threaded locking pins are threaded through a portion or extension of the waveguide structure that accommodates the slideable end of the connector members. The tapered end of each locking pin engages a tapered recess in a connector member. Longitudinal translation and fixed coupling of the two waveguide structures is achieved by screwing the tapered ends of the locking pins into full registration with the tapered recesses in the connector members. The connector members can be rotatable about the locking pins and partial retraction of the locking pins permits ready disengagement of the connector members from the other waveguide.