Abstract: A method for plating conductive plastics. The area to be plated is abrasively blasted as necessary to produce suitable mechanical bonding sites. The area is cleaned with a hot alkaline cleaning solution that will not appreciably attack the plastic. The area is sensitized to provide a base for firm adhesion of the metal onto the plastic. Sensitizing a graphite-reinforced epoxy composite preferably includes flowing a dilute solution of hydrochloric acid over the area, flowing a palladium chloride catalyst, rinsing the area, flowing a stannous accelerator, and rinsing the area again. Striking is then carried out by flowing an electroless plating solution over the area to provide a preliminary deposit of metal. The electroless solution may be either copper or nickel. The flowing of each solution is done at a very low velocity to ensure effective and even action on the entire area. Following striking, a plating buildup is provided as required.

Abstract: If necessary, initial cleaning of the plastic and masking of areas not to be plated are carried out. Contact points for cathode leads are chosen spaced from the area to be plated. Said area and the contact points are cleaned with a solvent. The contact points are prepared for a brush plating operation. If necessary, this preparation includes an initial abrading of the contact points with fine grit sandpaper. Preferably, the preparation comprises making a cathode lead contact in the area to be plated and brush plating the contact points to about 0.1 mil at a low current density, using an alkaline plating solution. The cathode lead contact is disconnected and the contact points are rinsed. A cathode lead is then connected to each contact point and brush plating of the area to be plated is carried out at a current density sufficiently low to prevent overheating of the plastic, using an alkaline plating solution.