Patents by Inventor Rob Brindley

Rob Brindley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates
    Patent number: 10046158
    Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: August 14, 2018
    Assignee: STRYKER CORPORATION
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, Jr., Leland Joseph Spangler
  • Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier
    Patent number: 8781600
    Abstract: An implantable electrode array that includes multiple spaced apart electrodes to which current can be individually sourced and sunk. The array includes a carrier that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in recesses within the carrier. A sheet of material more flexible than the carrier is disposed between, on one side, the carrier and the control modules and, on the other side, the electrodes. Conductors over which instructions and power are applied to the control modules and conductors that extend between the control modules are the electrodes are embedded in and extend through the sheet of flexible material.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: July 15, 2014
    Assignee: Stryker Corporation
    Inventors: John Janik, Rob Brindley, Rakesh Babu Katragadda, Edward Chia-Ning Tang
  • Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
    Patent number: 8554340
    Abstract: An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: October 8, 2013
    Assignee: Stryker Corporation
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, Jr., Leland Joseph Spangler
  • IMPLANTABLE ELECTRODE ARRAY ASSEMBLY WITH AN ARRAY SUBTRATE, ELECTRODES AND INTEGRATED CIRCUITS, THE INTEGRATED CIRCUITS BEING ATTACHED TO PACKAGE SUBSTRATES
    Publication number: 20120330393
    Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 27, 2012
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, JR., Leland Joseph Spangler
  • IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER FOR SUPPORTING THE ELECTRODES AND CONTROL MODULES FOR REGULATING OPERATION OF THE ELECTRODES EMBEDDED IN THE CARRIER, AND METHOD OF MAKING SAME
    Publication number: 20120310316
    Abstract: An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.
    Type: Application
    Filed: February 2, 2012
    Publication date: December 6, 2012
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, JR., Leland Joseph Spangler
  • IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER FOR SUPPORTING THE ELECTRODES AND CONTROL MODULES FOR REGULATING OPERATION OF THE ELECTRODES EMBEDDED IN THE CARRIER, AND METHOD OF MAKING SAME
    Publication number: 20110034977
    Abstract: An implantable electrode array that includes multiple spaced apart electrodes to which current can be individually sourced and sunk. The array includes a carrier that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in recesses within the carrier. A sheet of material more flexible than the carrier is disposed between, on one side, the carrier and the control modules and, on the other side, the electrodes. Conductors over which instructions and power are applied to the control modules and conductors that extend between the control modules are the electrodes are embedded in and extend through the sheet of flexible material.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 10, 2011
    Inventors: John Janik, Rob Brindley, Rakesh Babu Katragadda, Edward Chia-Ning Tang