Abstract: An overhead traveling camera inspection system for inspecting the condition of electronic semiconductor devices after being handled by a pick and place mechanism, and for automatically determining and calibrating the precise location of modules serviced by the pick and place mechanism for more accurate picking and placing of semiconductor devices.

Abstract: A high-speed linear pick-and-place for increasing the speed of transfer of semiconductor electronic devices with accommodation for automated inspection or test. The invention includes two or more linear pick-and-place assemblies, each having two or more independently positionable pick-and-place nozzles. These assemblies are aligned such that the 4 or more nozzles can all pick and place to common shared locations. The 4 or more nozzles are operated so that they can pass by each other on their return stroke, except that nozzles sharing a rail cannot pass each other.

Abstract: A high-speed tray transfer system for trays of semiconductor devices for increasing the rate at which trays are delivered to, and advanced through, a pick and place that moves orthogonal to the tray movement, so as to increase the overall throughput speed of a semiconductor handling machine. The invention utilizes two or more platens that carry trays. The platens can pass over, under or otherwise around each other so that while one platen is under and servicing the pick and place, another platen is cycling around and preparing another tray of electronic devices for the pick and place.