Abstract: A deposition device is provided for depositing components on a substrate. The deposition device comprises a substrate holder, a component carrier, a power supply and a support module for supporting the component carrier. The substrate holder has a substrate support surface for holding the substrate. The component carrier, which is supported by the support module has a component carrier surface facing the substrate support surface for carrying the components to be deposited on the substrate. The component carrier comprises a resistive heater layer for thermally inducing a deformation of the component carrier to move the component carrier surface towards the substrate support surface. The power supply is configured to generate a deflection pulse, being an electric power pulse to the resistive heater layer for said thermally inducing a deformation. Also a corresponding deposition method is provided.

Abstract: A donor plate for deposition of a deposition substance on a target is disclosed herein. The donor plate includes a flexible substrate, which at a first main surface of the flexible substrate has, in sequential order, further layers in the form of: an electrode layer, a first electrically insulating layer, a resistive heater layer, a second electrically insulating layer and a patterned layer provided with one or more recesses for holding deposition substance to be deposited on the target. The electrode layer comprises a first and a second electrode of a complementary shape and being electrically insulated from each other. The resistive heater layer is electrically connected to each of a contact surface of the first electrode and a contact surface of the second electrode via at least one respective slit in the first electrically insulating layer.

Abstract: A method and system for light induced transfer of components (15) from a donor substrate (10) to an acceptor substrate (20). The donor substrate (10) comprises a transparent carrier (11) configured to carry the components (15) facing the acceptor substrate (20), and a release stack (S). The release stack (S) comprises a light-absorbing layer (12), a decomposition layer (16), a melt layer (13), and an adhesive layer (14). The light-absorbing layer (12) has a high absorption coefficient for absorbing the light beam (L) causing heat conduction to the melt layer (13). The light-absorbing layer (12) remains solid while the melt layer (13) is melted. The adhesive layer (14) adheres the components (15) to the melt layer (13) while the melt layer (13) is solid and releases adhesion when the melt layer (13) is melted (M).

Abstract: A thermal processing device is disclosed herein for thermally processing material on a substrate. The thermal processing device includes a support plate which at a first main side is provided with a layer stack having a free surface for supporting the substrate, wherein the free surface defines a reference plane and which layer stack includes a first resistive heating layer, a second resistive heating layer, and an electrical insulator layer between the first resistive heating layer and the second resistive heating layer. The resistive heating layer each comprise a respective plurality of mutually electrically insulated resistive heating strips that extend in a mutually different directions. Respective pairs of a resistive heating strip of the first plurality and a resistive heating strip of the second plurality overlap in respective areas.

Abstract: A printing device is provided for printing a substance on a target surface of a target. The printing device comprises a carrier having at a first main side a hydrophobic coating for carrying a specimen of the substance to be printed, the specimen resting with a contact surface on the coating. The printing device further comprises a heater facility to locally heat the specimen at its contact surface to vaporize a portion of the specimen at the side of its contact surface and inducing a vapor pressure that causes a transfer of a remainder of the specimen towards the target surface. Additionally a printing method is provided.

Abstract: An improved heater plate is provided herewith that comprises a carrier plate having a first main side and a second main side opposite the first main side. The carrier plate is provided at the first main side with a resistive heating layer and is provided with a plurality of busbars that are accommodated in respective V-shaped grooves in the carrier plate at the second main side. The V-shaped grooves taper inward in the direction of the first main side towards respective slit-shaped openings, and the busbars are electrically connected with the resistive heating layer through the respective slit-shaped openings. Also a method of manufacturing the improved heater plate is provided as well as a heater device comprising the heater plate.

Abstract: A deposition device is disclosed herein for depositing components on a target surface of a target, the deposition device comprises a donor plate, at least one heater element, a power supply, a target manipulation device and a controller configured for controlling the power supply and the target manipulation device. The controller causes the power supply to supply at least a first pulse of electric power to the at least one heater element in a zone to heat the donor plate surface in at least a first subzone of that zone to a surface temperature exceeding a threshold temperature of an adhesive specimen in said first subzone. Subsequent to a change of a lateral position of the target relative to the donor plate, the controller causes the power supply to supply at least a second pulse of electric power to the heater element to heat the donor plate surface in at least a second subzone to a surface temperature exceeding a threshold temperature of the adhesive specimen in said second subzone.

Abstract: A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Abstract: A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

Abstract: The present disclosure pertains to a deposition system, a method and use of such system for filling a groove provided into surface of a workpiece with a printable medium, in particular a highly viscous paste. The system includes a deposition head that includes a first deposition chamber that extends to a first orifice. The orifice is reversibly closed off between at least two shutter elements. In some embodiments the system is a dual chamber system, each chamber having a reversible closable orifice. The system is arranged to maintain a flush physical relationship between the workpiece and the terminal ends of the shutter elements, so as to, upon application of a working pressure, fill the groove.

Abstract: A method and system for light induced transfer of components (15) from a donor substrate (10) to an acceptor substrate (20). The donor substrate (10) comprises a transparent carrier (11) configured to carry the components (15) facing the acceptor substrate (20), and a release stack (S). The release stack (S) comprises a light-absorbing layer (12), a decomposition layer (16), a melt layer (13), and an adhesive layer (14). The light-absorbing layer (12) has a high absorption coefficient for absorbing the light beam (L) causing heat conduction to the melt layer (13). The light-absorbing layer (12) remains solid while the melt layer (13) is melted. The adhesive layer (14) adheres the components (15) to the melt layer (13) while the melt layer (13) is solid and releases adhesion when the melt layer (13) is melted (M).

Abstract: A method and system for light induced transfer of components from a donor substrate to an acceptor substrate are described. The donor substrate includes a transparent carrier configured to carry the components facing the acceptor substrate, and a release stack. The release stack includes a light-absorbing layer, a melt layer, and an adhesive layer. The light-absorbing layer has a relatively high absorption coefficient for absorbing the light beam causing heat which is conducted to the melt layer. The light-absorbing layer has a relatively high melting temperature such that the light-absorbing layer can remain solid while the melt layer is melted. The adhesive layer adheres the components to the melt layer while the melt layer is solid and releases adhesion when the melt layer is melted.

Abstract: A plate including functional material to be deposited onto a target surface using monochromatic radiation having a wavelength is described. The plate further includes a substrate with a first surface directed towards the target surface and with a second surface to receive the monochromatic radiation. The first surface is patterned with recessed areas that have a dielectric coating and that are filled with the functional material. The dielectric coating includes a sequence of dielectric coating layers alternating in refractive index. The dielectric coating therewith has a relatively high reflectivity for said monochromatic radiation incident perpendicular to the dielectric coating in comparison to a reflectivity for said monochromatic radiation incident at an angle of 45 degrees to the dielectric coating. As such shear forces are mitigated without requiring a high alignment accuracy. The present application further describes a deposition device including the plate and a method involving the plate.

Abstract: A donor plate for deposition of a deposition substance on a target is disclosed herein. The donor plate includes a flexible substrate, which at a first main surface of the flexible substrate has, in sequential order, further layers in the form of: an electrode layer, a first electrically insulating layer, a resistive heater layer, a second electrically insulating layer and a patterned layer provided with one or more recesses for holding deposition substance to be deposited on the target. The electrode layer comprises a first and a second electrode of a complementary shape and being electrically insulated from each other. The resistive heater layer is electrically connected to each of a contact surface of the first electrode and a contact surface of the second electrode via at least one respective slit in the first electrically insulating layer.

Abstract: A method of manufacturing a layered 3D product is described that includes providing a radiation transparent film that carries a resin layer that in at least a first lateral region of a first sublayer at a side of the film is at least substantially cured and that is at least substantially uncured in a second sublayer thereof that has a free surface at a side of the resin layer facing away from the radiation transparent film. The film is laminated with a target, and the resin layer faces the target. The resin layer is fully cured in at least a third lateral region. Subsequently, the film is delaminated from the target. The fully cured material of the resin layer present in the at least a third lateral region remains on the target, and the film and the remainder of resin material thereon are removed from the target.

Abstract: A method and system for light induced transfer of components from a donor substrate to an acceptor substrate are described. The donor substrate includes a transparent carrier configured to carry the components facing the acceptor substrate, and a release stack. The release stack includes a light-absorbing layer, a melt layer, and an adhesive layer. The light-absorbing layer has a relatively high absorption coefficient for absorbing the light beam causing heat which is conducted to the melt layer. The light-absorbing layer has a relatively high melting temperature such that the light-absorbing layer can remain solid while the melt layer is melted. The adhesive layer adheres the components to the melt layer while the melt layer is solid and releases adhesion when the melt layer is melted.

Abstract: The present disclosure pertains to a deposition system, a method and use of such system for filling a groove provided into surface of a workpiece with a printable medium, in particular a highly viscous paste. The system includes a deposition head that includes a first deposition chamber that extends to a first orifice. The orifice is reversibly closed off between at least two shutter elements. In some embodiments the system is a dual chamber system, each chamber having a reversible closable orifice. The system is arranged to maintain a flush physical relationship between the workpiece and the terminal ends of the shutter elements, so as to, upon application of a working pressure, fill the groove.

Abstract: An apparatus is described for carrying out controlled local heating a target surface of a substrate provided with a heat sensitive material to change a state of the heat sensitive material. The apparatus includes a carrier having a carrier surface for carrying the substrate at a carried surface opposite the target surface. The carrier has a plurality of laterally distributed heating zones that are thermally insulated from each other by slits that are in communication with an evacuation channel. The respective heating zones include respective resistive heating elements and are thermally coupled to a heat sink. The apparatus further includes a controller configured to control a selective supply of electric energy to at least one of the respective resistive heating elements of at least one of the plurality of laterally distributed heating zones.

Abstract: A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Abstract: It is proposed to provide a transfer method of a high viscosity functional material, such as a conductive paste, onto a receiving substrate, the method comprising the steps of: providing a plate having a cavity surface that includes at least one cavity; providing the cavity with a resistive heating device and control circuitry connected to the heating device; providing a functional material in the at least one cavity, having a material composition that, when heated by the heating device, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the at least one cavity by the gas generation onto the receiving substrate.