Patents by Inventor Rob Nickerson

Rob Nickerson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of interconnecting workpieces
    Patent number: 7971347
    Abstract: Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: July 5, 2011
    Assignee: Intel Corporation
    Inventors: Leonel Arana, Rob Nickerson, Lim Chong Sim, Edward Prack, Yoshihiro Tomita
  • Apparatus and methods of forming package-on-package interconnects
    Publication number: 20090320281
    Abstract: Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
    Type: Application
    Filed: June 27, 2008
    Publication date: December 31, 2009
    Inventors: Leonel Arana, Rob Nickerson, Lim Chong Sim, Edward Prack, Yoshihiro Tomita