Patents by Inventor Rob Protheroe

Rob Protheroe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Top port MEMS cavity package and method of manufacture thereof
    Patent number: 9337354
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: May 10, 2016
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Top Port MEMS Cavity Package and Method of Manufacture Thereof
    Publication number: 20150315014
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: July 13, 2015
    Publication date: November 5, 2015
    Applicant: UNISEM (M) BERHAD
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Top port MEMS cavity package and method of manufacture thereof
    Patent number: 9082883
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 14, 2015
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Top port MEMS cavity package and method of manufacture thereof
    Patent number: 8999757
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: April 7, 2015
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan
  • Top Port MEMS Cavity Package and Method of Manufacture Thereof
    Publication number: 20140246738
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: March 4, 2013
    Publication date: September 4, 2014
    Applicant: UNISEM (M) BERHAD
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan
  • Top Port MEMS Cavity Package and Method of Manufacture Thereof
    Publication number: 20140246739
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: December 27, 2013
    Publication date: September 4, 2014
    Applicant: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua