Abstract: The present invention discloses a system for the effective capturing, amplifying, and redistribution of radio spectrum services. The system comprises a donor site with an antenna to receive signals, which are then filtered into multiple frequency bands. The filtered signals are amplified and converted into modulated light by a Hybrid Fiber Coax RF over Glass (RFOG) headend transmitter. The modulated light is carried via a fiber-optic cable to a Planar Lightwave Circuit (PLC) splitter that divides the light beam, directing it to multiple service sites. Each service site is equipped with an RFOG HFC node receiver that reconverts the modulated light back into radio signals. A transmission amplifier boosts these radio signals, enabling broad coverage and efficient redistribution of various radio spectrum services.

Abstract: The present invention discloses a system for the effective capturing, amplifying, and redistribution of radio spectrum services. The system comprises a donor site with an antenna to receive signals, which are then filtered into multiple frequency bands. The filtered signals are amplified and converted into modulated light by a Hybrid Fiber Coax RF over Glass (RFOG) headend transmitter. The modulated light is carried via a fiber-optic cable to a Planar Lightwave Circuit (PLC) splitter that divides the light beam, directing it to multiple service sites. Each service site is equipped with an RFOG HFC node receiver that reconverts the modulated light back into radio signals. A transmission amplifier boosts these radio signals, enabling broad coverage and efficient redistribution of various radio spectrum services.

Abstract: A substrate patterning method including the steps of spraying ink on a surface of a substrate, the spraying of the ink resulting in an overspray of excess ink past an edge of the substrate; changing a temperature of the excess ink to cause a change in a viscosity of the excess ink; and removing the excess ink having the changed viscosity.

Abstract: Embodiments of apparatuses and methods for removal of ink buildup are generally described herein. Other embodiments may be described and claimed. In an embodiment, a chuck assembly to support a semiconductor substrate is provided. The chuck assembly includes a chuck, a trough disposed below the chuck, and a heater proximate to the trough. The chuck supports the semiconductor substrate while the trough collects an overspray of excess ink sprayed past an edge of the semiconductor substrate. The heater heats the trough.