Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to load an integrated circuit (IC) into a socket. An example apparatus to load an IC in a socket includes: a collar; a tightener; a ramp carried by at least one of the collar or the tightener; and a cam carried by at least another one of the collar or the tightener, the cam engageable with the ramp, rotation of the tightener to cause relative movement between the cam and the ramp to displace the collar to apply a load to the IC.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

Abstract: Techniques are described for incorporating telemetry related to power source loading and the frequency of power-control events as part of a power balancing algorithm to control an electronic devices' power budgeting among devices sharing a common power source. The techniques utilize telemetry and control loop algorithms to dynamically balance the power between two or more electronic components, which may include a CPU and a GPU. The techniques as described herein function to monitor power source loading as well as the frequency of a predetermined set of events, which may include performance and/or power control events. Based on this information, the power budgets of the devices may be dynamically adjusted up or down to maximize performance, in contrast with the conventional usage of artificial static performance caps.