Patents by Inventor Rob van Ekeren

Rob van Ekeren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder preforms for use in electronic assembly
    Patent number: 7533793
    Abstract: A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surface has an enlarged planar surface area. Methods for forming such solder preforms are also disclosed.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: May 19, 2009
    Assignee: Fry's Metals, Inc.
    Inventors: Paul Godijn, Wim Veldhuizen, Patrick Lusse, Mitchell T. Holtzer, Rob van Ekeren, Martin de Haan