Abstract: A system for cooling electronic components in a cooling fluid immersion environment includes a container, a support, a conduit, and a pump. The container retains a first cooling fluid. The support suspends the electronic components in the container. The conduit transports the cooling gas into the container. The conduit includes an inlet section, a middle section, and an outlet section. The inlet section includes a conduit inlet positioned outside of the container. The outlet section includes outlets. The outlet section is submersed in the first cooling fluid within the container and beneath the electronic components such that the cooling gas exits the conduit and enters the first cooling fluid. The pump pressurizes and directs the cooling gas into and out of the conduit. The conduit is positioned downstream of the pump.

Abstract: A spine interconnect device for a datacenter with liquid-cooled electronic components. The spine interconnect device includes a first bus bar and a second bus bar. The first and second bus bars each include one or more high power conductors. The spine interconnect device further includes a spine support configured to suspend the first bus bar and the second bus bar above the electronic components and a plurality of tap-off boxes each with a plurality of power ports. Each tap-off box is connected to and supported by the first bus bar or the second bus bar. The spine interconnect device further includes a plurality of power cables interconnecting the plurality of power ports to the electronic components, a low power tray with networking cables, and a networking switch. The spine interconnect device further includes a cold water conduit and a warm water return conduit and a manifold.