Patents by Inventor Robbie Villanueva

Robbie Villanueva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method suitable for forming a microelectronic device package
    Publication number: 20040038451
    Abstract: Methods for forming the package are disclosed. The device package includes electrical connectors and an encapsulant. The package is formed by placing removable material over a portion of the connectors to prevent encapsulant attachment to the portions masked by the removable material.
    Type: Application
    Filed: August 26, 2003
    Publication date: February 26, 2004
    Inventors: Douglas A. Hawks, Siamak Fazelpour, Robbie Villanueva