Patents by Inventor Robel Vina

Robel Vina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly to selectively etch at inkjet printhead
    Patent number: 9259932
    Abstract: An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: February 16, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Lawrence H. White, Robel Vina, Sara Jensen Homeijer, Terry Mcmahon
  • Semiconductor device having a trace comprises a beveled edge
    Patent number: 9171793
    Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: October 27, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Lawrence H. White, Robel Vina, Terry Momahon, James R. Przybyla
  • SEMICONDUCTOR DEVICE
    Publication number: 20120299186
    Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
    Type: Application
    Filed: May 26, 2011
    Publication date: November 29, 2012
    Inventors: Lawrence H. White, Robel Vina, Terry Momahon, James R. Przybyla
  • ASSEMBLY TO SELECTIVELY ETCH AT INKJET PRINTHEAD
    Publication number: 20120298622
    Abstract: An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.
    Type: Application
    Filed: May 27, 2011
    Publication date: November 29, 2012
    Inventors: Lawrence H. White, Robel Vina, Sara Jensen Homeijer, Terry Mcmahon