Patents by Inventor Robert A. Binstead

Robert A. Binstead has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method
    Publication number: 20070012576
    Abstract: Methods of depositing layers of copper that selectively incorporate certain impurities are provided. Such copper layers reduce stress-induced void formation in wide copper lines under vias.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 18, 2007
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Robert A. Binstead, Chunyi Wu, Robert D. Mikkola
  • Electrode, electrochemical cell, and method for analysis of electroplating baths
    Patent number: 7144488
    Abstract: A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: December 5, 2006
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert A. Binstead, Osnat Younes-Metzler, David A. Valeri, Robert D. Mikkola
  • Plating bath analysis
    Patent number: 6827839
    Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: December 7, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
  • Electroplating composition
    Publication number: 20040222104
    Abstract: Compositions useful for electrodepositing a metal are provided. These compositions contain one or more metal salts, electrolyte, two or more brightener compounds and optionally one or more of leveler compounds and wetting agents. Also provided are methods of depositing a metal layer using these compositions.
    Type: Application
    Filed: February 13, 2004
    Publication date: November 11, 2004
    Applicant: Rohm and Haas Electronic Materials, L.L.C
    Inventors: Deyan Wang, Robert D. Mikkola, Robert A. Binstead
  • Electrode, electrochemical cell, and method for analysis of electroplating baths
    Publication number: 20040089538
    Abstract: A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.
    Type: Application
    Filed: June 5, 2003
    Publication date: May 13, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Robert A. Binstead, Osnat Younes-Metzler, David A. Valeri, Robert D. Mikkola
  • Electroplating bath control
    Patent number: 6645364
    Abstract: Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: November 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead
  • Electroplating bath control
    Publication number: 20030205476
    Abstract: Disclosed is a method of analyzing organic components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Application
    Filed: June 9, 2003
    Publication date: November 6, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead
  • Copper electroplating
    Patent number: 6610192
    Abstract: Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: August 26, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Eugene N. Step, Robert A. Binstead, Denis Morrissey
  • Plating bath analysis
    Publication number: 20020074244
    Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
    Type: Application
    Filed: November 2, 2001
    Publication date: June 20, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
  • Electroplating bath control
    Publication number: 20020060157
    Abstract: Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Application
    Filed: October 19, 2001
    Publication date: May 23, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead