Patents by Inventor Robert A. Boie

Robert A. Boie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070215805
    Abstract: A sensor that is responsive to at least two distinct spectral bands, e.g., infrared radiation and ultraviolet or infrared and visible light makes use of the junction of a diode-based bolometer as a photocell in addition to its temperature dependence for detecting infrared radiation. More specifically the diode bolometer is arranged to work in the conventional manner, in that an electrical characteristic of the diode, e.g., the temperature dependence of its current-voltage (I-V) curve, is used as the basis for measuring temperature, and hence, infrared radiation. Additionally, the same diode may be operated as a photocell to detect radiation that is capable of interacting with the electrons in the junction of the diode. This may be achieved by detecting a change in the operating point of the diode based given its present biasing in response to noninfrared radiation incident upon the diode.
    Type: Application
    Filed: March 17, 2006
    Publication date: September 20, 2007
    Inventors: Robert Boie, Cristian Bolle
  • Publication number: 20050111786
    Abstract: A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converters and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.
    Type: Application
    Filed: July 24, 2001
    Publication date: May 26, 2005
    Inventors: Robert Boie, Jungsang Kim, Hyongsok Soh
  • Patent number: 6140737
    Abstract: An electrostatic actuator and a method for actuating a micro-machine structure. The micro-machine structure has a stationary part and a movable part that is relatively movable between a rest position and an activated position and is resiliently connected to the stationary part. The stationary part and the movable part form a flexible sub-structure having a resonant frequency. The actuator comprises a first electrode disposed on the stationary part and a second electrode disposed on the movable part. The actuator also includes a wave generator, connected to the first electrode and the second electrode, for generating an alternating voltage signal to the first electrode and a reference voltage signal to the second electrode so as to impart an electrostatic force between the stationary and movable parts and to move the movable part from the rest position to the activated position. The electrostatic force for fixed amplitude wave has a constant force component and a vibratory force component.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: October 31, 2000
    Assignee: Lucent Technologies Inc.
    Inventor: Robert A. Boie
  • Patent number: 5572441
    Abstract: Portable computing and communications devices are connected with other, typically fixed devices via the use of a capacitive data connector. Each of the two mating sections of the connector includes a set of coupling plates. When the two sections are brought into contact, the coupling plates form capacitors across which data signals can be passed. Circuitry driving each section of the data connector is such as to create a bidirectional signaling path, thereby providing a connection which is functionally equivalent to an ohmic connection. Signals that are typically passed across data connectors on individual parallel leads are, in the present data connector, serialized, passed across the connector in that form and connected back to parallel form on the other side of the connection. Each section of the connector illustrately includes a permanent magnet to draw and hold the two sections in alignment, thereby providing a connector which is self-aligning.
    Type: Grant
    Filed: April 4, 1994
    Date of Patent: November 5, 1996
    Assignee: Lucent Technologies Inc.
    Inventor: Robert A. Boie
  • Patent number: 5517012
    Abstract: A circuit that prevents optical screening systems from being pinned in an inoperative state under certain light conditions. The invention accomplishes this by using a circuit comprising a photodetector for converting scattered light from a visual code (e.g., universal product code) into current and a current limiting circuit coupled to the photodetector for limiting the current capable of passing through the photodetector.
    Type: Grant
    Filed: September 8, 1994
    Date of Patent: May 14, 1996
    Assignee: AT&T Corp.
    Inventors: Robert A. Boie, Gabriel L. Miller
  • Patent number: 5463388
    Abstract: A computer input device for use as a computer mouse or keyboard comprises a thin, insulating surface covering an array of electrodes. Such electrodes are arranged in a grid pattern and can be connected in columns and rows. Each column and row is connected to circuitry for measuring the capacitance seen by each column and row. The position of an object, such as a finger or handheld stylus, with respect to the array is determined from the centroid of such capacitance values, which is calculated in a microcontroller. For applications in which the input device is used as a mouse, the microcontroller forwards position change information to the computer. For applications in which the input device is used as a keyboard, the microcomputer identifies a key from the position of the touching object and forwards such key identity to the computer.
    Type: Grant
    Filed: January 29, 1993
    Date of Patent: October 31, 1995
    Assignee: AT&T IPM Corp.
    Inventors: Robert A. Boie, Laurence W. Ruedisueli, Eric R. Wagner
  • Patent number: 5337353
    Abstract: Capacitive proximity sensors are disclosed that can be fabricated in different shapes, sizes and materials used in a wide variety of applications. Each such sensor includes a sensing electrode and a guard electrode. The sensor electrode and guard electrode can be parallel conductors separated by an insulating layer, such as a double-sided circuit board shaped to suit the application. One such sensor is transparent for use in conjunction with an optical bar-code scanner. Another sensor is annular in shape for use in conjunction with a telephone transmitter. The sensing electrode and the guard electrode are driven in unison by an RF signal. The proximity of an object to the sensor is observed by detecting changes in the RF current flowing through the sensing electrode caused by the proximity of an object to the sensing electrode.
    Type: Grant
    Filed: April 1, 1992
    Date of Patent: August 9, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Robert A. Boie, Gabriel L. Miller
  • Patent number: 5113041
    Abstract: Information processing, for example by means of a computer, is served by a tablet in combination with an inputting implement such as stylus or human finger. Such a tablet-implement combination may serve in lieu of or ancillary to other inputting means such as a keyboard. Implement positional information, e.g., as contacting the tablet, depends upon interpolation as between segmenting lines in the tablet. Cost advantage commensurate with resolution/noise desiderata is ascribable to use of analog information (without digitization) in interpolation.
    Type: Grant
    Filed: December 28, 1990
    Date of Patent: May 12, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Greg E. Blonder, Robert A. Boie
  • Patent number: 4982333
    Abstract: There are disclosed methods and apparatuses for the assembling of parts using capacitive sensing, both for controlling the closure or "homing" phase of the assembly process and for acquiring one or more of the parts prior to that phase. Assembling of semiconductor parts to essentially two-dimensional and three-dimensional packages, the insertion of a peg in a hole, and an application to tape-automated-bonding (TAB) technology are all described, as are various representations of the resulting capacitive data. Included are the uses of scheduling and optical sensing to supplement capacitive sensing in the methods and apparatuses.
    Type: Grant
    Filed: October 13, 1988
    Date of Patent: January 1, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: David A. Ackerman, Robert A. Boie
  • Patent number: 4526043
    Abstract: A force sensor includes an elastic dielectric, a first plurality of conductive elements on one side of the dielectric and a second plurality of conductive elements on the opposite side of the dielectric. First signals are applied to one plurality of conductive elements through nonconductive coupling. Second signals representative of the forces on said elastic dielectric are generated responsive to the applied first signals coupled to the other plurality of conductive elements.
    Type: Grant
    Filed: May 23, 1983
    Date of Patent: July 2, 1985
    Assignee: AT&T Bell Laboratories
    Inventors: Robert A. Boie, Gabriel L. Miller
  • Patent number: 4282437
    Abstract: In a high-throughput electron beam exposure system, an electron spot is rapidly scanned across a mask plate that includes an aperture whose opening dimension parallel to one axis varies as a function of position along another axis. The extent of each scan across the aperture purposely exceeds the opening dimension of the aperture at any specified scanning position. In this way, the relatively inaccurate end or on-off portions of each scan line are in effect mechanically blanked by the apertured plate. High-speed uniform scanning of an electron spot along a precisely defined line segment on a surface to be irradiated is thereby realized. Such a system is characterized by high-speed exposure of the surface with excellent edge definition of specified features.
    Type: Grant
    Filed: December 17, 1979
    Date of Patent: August 4, 1981
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Robert A. Boie