Abstract: A method of making a glass lenticular array is provided. The method comprises: heating a sheet of glass, the sheet of glass comprising contact regions located thereupon in substantially parallel linear rows; and deforming the heated sheet of glass by contacting the contact regions with a forming body so as to form a plurality of cylindrical lenses in the heated sheet of glass, the plurality of cylindrical lenses arranged in substantially parallel rows with depressed regions between adjacent cylindrical lenses. The depressed regions are formed at the contact regions while apex regions of the cylindrical lenses are kept untouched during the step of deforming.

Abstract: A method and apparatus is provided for attaching a bulk element processing an optical beam to a PLC and optically aligning the bulk element with an optical element formed on the PLC. The method begins by securing the bulk element to a first side of a substrate. A first side of a flexure element is secured to the first side of the substrate. A second side of the flexure element is secured to a first side of the PLC on which the optical element is formed such that the bulk element and the optical element are in optical alignment to within a first level of tolerance. Subsequent to the step of securing the second side of the flexure element, a force is exerted on at least a second side of the substrate to thereby flex the flexure element. The force causes sufficient flexure of the flexure element to optically align the bulk element and optical element to within a second level of tolerance that is more stringent than the first level of tolerance.

Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.

Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.

Abstract: An optical receiver module includes a silicon wafer defining opposed first and second surfaces and having a transverse opening through the silicon wafer. The opening has at least two generally planar surfaces which intersect to form a V-shaped registration comer. An optical detector is secured to the first surface of the silicon wafer adjacent the opening, and an optical fiber has an end portion positioned within the transverse opening. The optical fiber has an outer surface in contact with the generally planar surfaces to position the end portion of the optical fiber within the opening. A fiber holder includes a pair of silicon chips, each having a V-groove. The optical fiber is positioned in the V-grooves and sandwiched between the silicon chips. The silicon chips are secured to the silicon wafer to retain the optical fiber.

Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.

Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330,230, and/or 30) forming a transmission line (340) for propagating high frequency signals.

Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330, 230, and/or 30) forming a transmission line (340) for propagating high frequency signals.

Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.

Abstract: According to the present invention, an optical waveguide is provided on a silica or silicon substrate using MPACVD and ICP etching processes. Optical fiber is coupled to the waveguide by positioning the fiber in a groove formed in the waveguide and compressing a top lid on the fiber. The top lid is secured to the waveguide and fiber by an epoxy or a solder. In a solder based embodiment, the cladding of the fiber may have a metallization evaporated thereon.

Abstract: The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.

Abstract: The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.

Abstract: An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

Abstract: The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.

Abstract: A planar hybrid optical amplifier is fabricated on a single crystal substrate. The components that are common to a variety of optical amplifier circuits are mounted on the substrate and the planar device that results is readily interchanged in various applications. In one embodiment the multiplexed signal consisting of light from a pump laser and an optical signal are introduced into a rare earth doped fiber which amplifies the input signal through stimulated emission of radiation.

Abstract: A dielectric substrate of a material such as silicon is used to provide controlled impedance waveguides for coupling an optoelectronic device to an electronic device. The impedance is controlled by varying the thickness of the dielectric between the signal lines and the ground plane. In the preferred embodiment, the crystallographic structure of the silicon is employed to achieve great precision of the dielectric thickness.

Abstract: A passively aligned optical interconnect is described for use as a wavelength division multiplexer (WDM) and demultiplexer. The device makes use of silicon waferboard for a low cost interconnect. Computer generated holograms are used to effect the multiplexing/demultiplexing as well as focusing of the beams. In an alternative embodiment, the device is used as a beam splitter for monochromatic light. In yet another embodiment, the device is used to spatially separate the polarization states of light.

Abstract: A passively aligned bi-directional optoelectronic transceiver module assembly utilizes a computer generated hologram as a diffractor to split/combine light beams of two different wavelengths. The entire assembly is constructed of monocrystalline silicon which is photolithographically batch processed to provide a low cost, compact structure with precision tolerances which is inherently passively aligned upon assembly.

Abstract: A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.

Abstract: The disclosure describes an optical interconnect which utilizes a silicon waferboard (1) with grooves (3,4) etched to expose preferred crystallographic planes to effect alignment of focusing elements (5) between optical waveguides (6) and optoelectronic devices (2). The focusing elements (5) are made of silicon wafers and are etched to expose crystal planes which compliment crystal planes of cavities or grooves which are etched in the waferboard. The focusing elements may have holograms (7) formed thereon for efficient focusing to the optical waveguide (6).