Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: The present invention disclose a method for the orientation of a high density polyethylene (“HDPE”) film. The process of the invention comprises forming a HDPE-wax mixture by adding to a HDPE batch a normally solid hydrocarbon wax. The HDPE-wax mixture is subsequently stretched into a film at an orientation temperature below the film's melt temperature. The hydrocarbon wax is characterized by having a drop point equal to or lower than the melting point of the HDPE film. The present invention also provides a film made by the process of the invention and a master batch thereof.

Abstract: Decorative system composites and methods for forming the same are described. The composites employ new and improved support film systems that have enhanced tensile strength under typical thermoforming conditions, including elevated temperatures. An optional release film can be used in conjunction with the support film. The support film is particularly suitable for use with decorative films used to impart a surface effect, such as paint or color-containing film systems, to a thermoformed plastic component. The support film systems also possess enhanced bag/sag/drape control characteristics.

Abstract: A laminate product for use as a protective and decorative sheet material for application to a substrate is described. The laminate product is comprised of: (1) a base coat layer comprising a colorant-containing thermoplastic resin system, the colorant being substantially uniformly distributed throughout the colorant-containing thermoplastic resin system; (2) a top coat layer; and (3) an adhesion promoting layer disposed between the base coat layer and the top coat layer. The colored base coat layer permits deeper draws for the formation of highly contoured components such as automotive bumpers and fascias, without the loss of color intensity or scratch resistance.

Abstract: A vacuum-tight wafer carrier, and a load lock suitable for use with this wafer carrier. The wafers are supported at each side by a slightly sloping shelf, so that minimal contact (line contact) is made between the wafer surface and the surface of the shelf. This reduces generation of particulates by abrasion of the surface of the wafer. The carrier also contains elastic elements to restrain the wafers from rattling around, which further reduces the internal generation of particulates. When the wafer carrier is placed into the load lock, its body is lowered from beneath its cover through an aperture into a lower chamber, where wafers are loaded and unloaded under vacuum; the carrier cover remains covering the aperture into the lower chamber, so that the wafers never see any surface which is directly exposed to atmosphere. A wafer transport arm mechanism permits interchange of wafers among one or more processing stations and one or more load locks of this type.

Abstract: A vacuum-tight wafer carrier, and a load lock suitable for use with this wafer carrier. The wafers are supported at each side by a slightly sloping shelf, so that minimal contact (line contact) is made between the wafer surface and the surface of the shelf. This reduces generation of particulates by abrasion of the surface of the wafer. The carrier also contains elastic elements to restrain the wafers from rattling around, which further reduces the internal generation of particulates. When the wafer carrier is placed into the load lock, its body is lowered from beneath its cover through an aperture into a lower chamber, where wafers are loaded and unloaded under vacuum; the carrier cover remains covering the aperture into the lower chamber, so that the wafers never see any surface which is directly exposed to atmosphere. A wafer transport arm mechanism permits interchange of wafers among one or more processing stations and one or more load locks of this type.

Abstract: A method and apparatus is provided for removing submicron sized particles from the surface of a silicon semiconductor wafer (38). Conventional cleaning methods are capable of only removing particles that are about 1 micron or larger in size. The present invention provides a way to increase the submicron particles in size so that they are removable by the known methods. The silicon semiconductor wafer (38) is cooled by a refrigeration unit (36) or by exposure to liquid nitrogen (74). The cooled wafer (38) is then exposed to a condensable material (42) which is allowed to condense on the surface of the wafer (38). The condensable material will surround any particles that are on the surface and cause them to grow in size due to the formation of frozen crystals. Without allowing the crystals to melt, the enlarged particles then are removed by any of the known methods.

Abstract: A vacuum processing system for processing semiconductor wafers includes a particle shield (16) disposed above the wafer (10) to block moving particles in a vacuum chamber which would otherwise contact the wafer (10). The particle shield (16) is attached to arm (18), allowing the particle shield (16) to be moved away from the wafer or photomask during processing.