Abstract: An improved scan and tilt apparatus for an ion implanter wherein a wafer-receiving platen assembly is received on the end member of a multiple axis arm system which is operable to effect scanning motion of the wafer along a straight line which intercepts the wafer tilt axis in any tilt position of the platen assembly. The arm system includes a rail and linear bearing system which interconnects an input member with the end member of the arm system to restrict the scanning motion to a straight line.

Abstract: An end station for an ion implanter includes a loading station, a loadlock station, a vacuum chamber and a wafer handler within the vacuum chamber. The wafer handler includes a wafer-receiving platen assembly on the end of a multiple axis arm system wherein the arm system is capable of positioning the wafer for low and high angle of incidence implantation, rotating the wafer about an axis perpendicular to the wafer surface, and effecting scanning motion of the wafer along a straight line which intercepts the wafer tilt axis in any tilt position of the platen assembly. The invention further includes a loadlock including an upper element receiving wafers from the loading station and a lower element operable to position wafers for engagement by a transfer arm which transfers wafers from the loadlock to the wafer handler.