Abstract: The teachings herein disclose a laser assembly (20) that implements a “composite cavity” formed in part in a III/V die (22), in part in a silicon die (26), and in part in a glass member (24) having a waveguide (44) coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.

Abstract: The disclosure relates to a tunable microring resonator, comprising a primary waveguide having first and second ends, a plurality of secondary waveguides each having a different length and each having first and second ends and a Micro-Electro-Mechanical System (MEMS) adjustable to optically couple at least a first end of the primary waveguide with a first respective end of a selected secondary waveguide thereby allowing light to circulate within the tunable microring resonator.

Abstract: The present invention relates to a method for creating nanostructures in and on organic or inorganic substrates comprising at least the following steps: a) providing a primary substrate having a predetermined refractive index; b) coating the primary substrate with one or more mediating layers each having a predetermined refractive index different from that of the primary substrate, wherein the sequence of the layers is arranged so that a predetermined gradient of the refractive index is generated between the primary substrate and the uppermost layer of the one or more mediating layers; c) optionally coating the uppermost layer of the one or more mediating layers with an additional top layer; d) depositing a nanostructured etching mask onto the uppermost layer of the composite substrate obtained after steps a)-b) or a)-c); e) generating protruding structures, in particular conical or pillar structures, or recessed structures, in particular holes, in at least the uppermost layer of the composite substrate by me

Abstract: The teachings herein provide a method and apparatus for interconnecting photonic devices using an advantageous technique that forms an end-to-end optical path between photonic circuits using photonic wire bonds and a bridging glass member. The photonic wire bonds couple the photonic circuits to respective ends of an optical waveguide formed in the glass member. The end-to-end optical path thus comprises a “composite” optical waveguide that includes the photonic wire bonds and the optical wave-guide. Advantageously, these composite optical waveguides are formed in-place according to a process whereby the various components are placed into at least a rough alignment on a substrate and, after deposition of polymer photoresist, a femtosecond laser beam traces the end-to-end optical path, thereby forming the respective photonic wire bonds and optical waveguide in place.

Abstract: The invention provides a method for increasing the order of an array of polymeric micelles or of nanoparticles on a substrate surface comprising a) providing an ordered array of micelles or nanoparticles coated with a polymer shell on a substrate surface and b) annealing the array of micelles or nanoparticles by ultrasonication in a liquid medium which is selected from the group comprising H2O, a polar organic solvent and a mixture of H2O and a polar organic solvent. In a related aspect, the invention provides the highly ordered arrays of micelles or nanoparticles obtainable by the methods of the invention.

Abstract: A small form-factor pluggable (SFP) module and related method are provided to perform additional packet processing in a communication network. The SFP module is generally configured to at least partially process data packets as they transit from a first networking equipment toward a second networking equipment in order to modify or otherwise update header information of the packets as a function of the content of their data payload. Modifying header information of data packets as they transit between interconnected networking equipments allows interconnected networking equipments to perform packet processing on the modified header information.