Abstract: A seat back for an aircraft seat includes a first side wall, a second side wall and a support wall for supporting a passenger leaning against the seat back. The first side wall and the second side wall each include a front edge and a rear edge. At least part of the support wall is positioned adjacent the front edge of the first side wall and the second side wall. The first side wall and the second side wall each include an aperture for receiving a bolt and the support wall includes one or more shaped surfaces to allow (i) insertion of a bolt through the aperture in each of the side walls from a position which is between the first and second side walls and in front of the shaped surface, and (ii) adjustment of the or each bolt from the front of the seat back.

Abstract: A system for imaging a subject is provided. The system includes a radiation source, a radiation detector, and a controller. The radiation source is operative to transmit electromagnetic rays through the subject. The radiation detector is operative to receive the electromagnetic rays after having passed through the subject so as to generate a plurality of projections of the subject. The controller is operative to display one or more selectively adjustable markers that define an image stack. The controller is further operative to reconstruct one or more images within the image stack based at least in part on the plurality of projections. Reconstruction of the one or more images is on demand.

Abstract: A system for imaging a subject is provided. The system includes a radiation source, a radiation detector, and a controller. The radiation source is operative to transmit electromagnetic rays through the subject. The radiation detector is operative to receive the electromagnetic rays after having passed through the subject so as to generate a plurality of projections of the subject. The controller is operative to display one or more selectively adjustable markers that define an image stack. The controller is further operative to reconstruct one or more images within the image stack based at least in part on the plurality of projections. Reconstruction of the one or more images is on demand.

Abstract: A spacer formation cell usable in configuration of a window assembly, wherein the cell includes a plurality of stages through which a spacer work piece is routed, and the stages include a holding stage, a cutting stage, a bending stage, and a connecting stage. The stages can be arranged in interlinked configuration, enabling spacers to be fabricated in a direct and time-efficient manner. The stages can be interlinked to form a framework, forming an exterior enclosure for the stages of the cell, and enabling at least of the majority of the cell's operations to be readily overseen by an operator from single vantage points around the cell. The configuration of the formation cell enables a wide variety of spacer types and/or sizes to be readily processed, with such processing to be readily alternated.

Abstract: Various embodiments for switching functionality of a graphical user interface (GUI) pointer input device are provided. A first gesture pattern is configured. The first gesture pattern, when performed, enables a predetermined function of the input device. The predetermined function substitutes for a default function of the input device. The enabling of the predetermined function is indicated to a user on the GUI. A second gesture pattern is configured. The second gesture pattern, when performed, cancels the predetermined function of the input device and enables the default function.

Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

Abstract: A multi-chamber heat sink module can provide fluid cooling of one or more heat providing surfaces. The module can include a first plurality of orifices fluidly connecting a first inlet chamber to a first outlet chamber. The first outlet chamber can be configured to be bounded by a portion of a heat providing surface. The first plurality of orifices can be configured to deliver a first plurality of jet streams of coolant into the first outlet chamber and against the portion of the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the first inlet chamber. The heat sink module can include a second inlet chamber fluidly connected to a first outlet passage and a second plurality of orifices fluidly connecting the second inlet chamber to a second outlet chamber.

Abstract: A spacer formation cell usable in configuration of a window assembly, wherein the cell includes a plurality of stages through which a spacer work piece is routed, and the stages include a holding stage, a cutting stage, a bending stage, and a connecting stage. The stages can be arranged in interlinked configuration, enabling spacers to be fabricated in a direct and time-efficient manner. The stages can be interlinked to form a framework, forming an exterior enclosure for the stages of the cell, and enabling at least of the majority of the cell's operations to be readily overseen by an operator from single vantage points around the cell. The configuration of the formation cell enables a wide variety of spacer types and/or sizes to be readily processed, with such processing to be readily alternated.

Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

Abstract: A two-phase cooling system can include a primary cooling loop and a heat rejection loop. The primary cooling loop can include a reservoir, a first pump fluidly connected to the primary cooling loop downstream of the reservoir, and a heat sink module fluidly connected to the primary cooling loop downstream of the first pump and upstream of the reservoir. The first pump can draw dielectric coolant from the reservoir and provide a primary flow of pressurized dielectric coolant through the primary cooling loop, with a first portion flowing through the heat sink module and a second portion flowing through a bypass. The heat rejection loop can be fluidly connected to the same reservoir and can include a second pump and a heat exchanger. The second pump can draw dielectric coolant from the reservoir and provide a secondary flow of pressurized coolant through the heat exchanger and back to the reservoir.

Abstract: A circuit board assembly, such as a motherboard, graphics card, sound card, or network card, can be adapted for fluid cooling. The circuit board assembly can include a processor electrically connected to a printed circuit board. The circuit board assembly can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings by sections of tubing. The heat sink module can be mounted on a surface to be cooled that is a surface of, or a surface in thermal communication with, the processor. When fluidly connected to a cooling system, coolant flowing through the cooling line assembly can flow through a plurality of orifices in the heat sink module forming a plurality of jet streams that are projected against the surface to be cooled, resulting in heat transferring from the processor to the flowing coolant.

Abstract: A server can include a cooling line assembly to provide fluid cooling of one or more server components. The server can include a chassis, a circuit board positioned within the chassis, and a processor electrically connected to the circuit board. The cooling line assembly can include a heat sink module on a surface to be cooled that is in thermal communication with the processor. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. The orifices can deliver jet streams of coolant into the first outlet chamber and against the surface to be cooled when pressurized coolant is provided to the inlet chamber of the heat sink module.

Abstract: A flexible cooling line assembly, when fluidly connected to a two-phase cooling apparatus, can provide device-level cooling to one or more devices. The assembly can include a first section of flexible, low-pressure tubing fluidly connected to an inlet port of a heat sink module. The heat sink module can include an inlet chamber fluidly connected to the inlet port and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. The outlet chamber can be fluidly connected to an outlet port of the module, and a second section of flexible, low-pressure tubing can be fluidly connected to the outlet port. The plurality of orifices can deliver a plurality of jet streams of coolant into the outlet chamber and against a heat providing surface when the first heat sink module is mounted to the heat providing surface and when pressurized coolant is delivered to the inlet chamber.

Abstract: A preferred embodiment of the subject invention is directed to creation and pricing of an option related to a target zone in a time-price plot. If the price curve against time enters this zone (in a preferred embodiment, a “box”), a fixed amount of money is paid to the owner of the option; if the curve misses the box, there is no payout to the option owner, who also forfeits the premium paid for the option. Software is described that enables an option buyer to easily create and set the parameters of such an option, that computes a premium for the option, and that manages payout and other functions related to the option. The above-described embodiment is a buy-to-hit option. Other embodiments are directed to sell-to-hit, buy-to-miss, and sell-to-miss options.

Abstract: Various embodiments for switching functionality of a graphical user interface (GUI) pointer input device are provided. A first gesture pattern is configured. The first gesture pattern, when performed, enables a predetermined function of the input device. The predetermined function substitutes for a default function of the input device. The enabling of the predetermined function is indicated to a user on the GUI. A second gesture pattern is configured. The second gesture pattern, when performed, cancels the predetermined function of the input device and enables the default function.

Abstract: A metrology/inspection system moves the imaging and/or measuring equipment of the system relative to a wafer. Accordingly, measurement or inspection of the wafer does not require that the wafer be mounted on a precision stage. This allows the wafer to be at rest on any structure native in a processing apparatus when the system measures or inspects the wafer. Accordingly, measurement does not require removing the wafer from the processing apparatus and does not delay processing since the wafer can be measured, for example, during a required cool down period of device fabrication process. Alignment of an optical system includes pre-alignment base on edge detection using the optical system and more precise alignment using image recognition. An R-? stage can position the optical system at inspection areas on the wafer. Image rotation can provide a fixed orientation for all images at the various inspection areas and can maintain the fixed orientation when moving from one inspection area to the next.