Patents by Inventor Robert A. Buchanan

Robert A. Buchanan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9852963
    Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: December 26, 2017
    Assignee: EBULLIENT, INC.
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
  • Publication number: 20170105313
    Abstract: A multi-chamber heat sink module can provide fluid cooling of one or more heat providing surfaces. The module can include a first plurality of orifices fluidly connecting a first inlet chamber to a first outlet chamber. The first outlet chamber can be configured to be bounded by a portion of a heat providing surface. The first plurality of orifices can be configured to deliver a first plurality of jet streams of coolant into the first outlet chamber and against the portion of the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the first inlet chamber. The heat sink module can include a second inlet chamber fluidly connected to a first outlet passage and a second plurality of orifices fluidly connecting the second inlet chamber to a second outlet chamber.
    Type: Application
    Filed: October 10, 2015
    Publication date: April 13, 2017
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan, Mark A. Rodarte
  • Publication number: 20160116224
    Abstract: A flexible cooling line assembly, when fluidly connected to a two-phase cooling apparatus, can provide device-level cooling to one or more devices. The assembly can include a first section of flexible, low-pressure tubing fluidly connected to an inlet port of a heat sink module. The heat sink module can include an inlet chamber fluidly connected to the inlet port and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. The outlet chamber can be fluidly connected to an outlet port of the module, and a second section of flexible, low-pressure tubing can be fluidly connected to the outlet port. The plurality of orifices can deliver a plurality of jet streams of coolant into the outlet chamber and against a heat providing surface when the first heat sink module is mounted to the heat providing surface and when pressurized coolant is delivered to the inlet chamber.
    Type: Application
    Filed: September 14, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
  • Publication number: 20160120059
    Abstract: A two-phase cooling system can include a primary cooling loop and a heat rejection loop. The primary cooling loop can include a reservoir, a first pump fluidly connected to the primary cooling loop downstream of the reservoir, and a heat sink module fluidly connected to the primary cooling loop downstream of the first pump and upstream of the reservoir. The first pump can draw dielectric coolant from the reservoir and provide a primary flow of pressurized dielectric coolant through the primary cooling loop, with a first portion flowing through the heat sink module and a second portion flowing through a bypass. The heat rejection loop can be fluidly connected to the same reservoir and can include a second pump and a heat exchanger. The second pump can draw dielectric coolant from the reservoir and provide a secondary flow of pressurized coolant through the heat exchanger and back to the reservoir.
    Type: Application
    Filed: October 27, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
  • Publication number: 20160120071
    Abstract: A server can include a cooling line assembly to provide fluid cooling of one or more server components. The server can include a chassis, a circuit board positioned within the chassis, and a processor electrically connected to the circuit board. The cooling line assembly can include a heat sink module on a surface to be cooled that is in thermal communication with the processor. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. The orifices can deliver jet streams of coolant into the first outlet chamber and against the surface to be cooled when pressurized coolant is provided to the inlet chamber of the heat sink module.
    Type: Application
    Filed: September 20, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
  • Publication number: 20160118317
    Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.
    Type: Application
    Filed: September 24, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
  • Publication number: 20160120019
    Abstract: A circuit board assembly, such as a motherboard, graphics card, sound card, or network card, can be adapted for fluid cooling. The circuit board assembly can include a processor electrically connected to a printed circuit board. The circuit board assembly can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings by sections of tubing. The heat sink module can be mounted on a surface to be cooled that is a surface of, or a surface in thermal communication with, the processor. When fluidly connected to a cooling system, coolant flowing through the cooling line assembly can flow through a plurality of orifices in the heat sink module forming a plurality of jet streams that are projected against the surface to be cooled, resulting in heat transferring from the processor to the flowing coolant.
    Type: Application
    Filed: October 6, 2015
    Publication date: April 28, 2016
    Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
  • Patent number: 6233304
    Abstract: The present invention, in one form, is a method for generating a calcification score in a CT image data using a scoring algorithm. In accordance with one embodiment of the algorithm, a calcium score is determined by identifying a scorable region in the image data, defining at least one region of interest in the scorable region, and determining a density score. After determining a calcium score for each region of interest, a total calcium score is determined. In addition, to correct for unequal and/or non-contiguous spacing of the slices of image data, a weighted total calcium score is determined.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: May 15, 2001
    Assignee: General Electric Company
    Inventors: Hui Hu, Robert A. Buchanan, Theophano Mitsa
  • Patent number: 5750811
    Abstract: Disclosed is a method of making m-chlorobenzotrifluoride. Benzotrifluoride is reacted with chlorine gas in the presence of about 0.1 to about 5 mole % (based on benzotrifluoride) of a metal chloride which can be FeCl.sub.3, SbCl.sub.3, or AlCl.sub.3 and about 0.025 to about 5.0 mole % (based on benzotrifluoride) of a catalyst having the formula ##STR1## where Z is halogen, alkyl from C.sub.1 to C.sub.6, alkoxy from C.sub.1 to C.sub.6, or fluoroalkyl from C.sub.1 to C.sub.6, n is 0 to 5, and the molar ratio of metal chloride to cocatalyst is about 0.5 to about 4.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: May 12, 1998
    Assignee: Occidental Chemical Corporation
    Inventors: Robert A. Buchanan, Ramesh Krishnamurti, Habib Hichri, David C. Johnson
  • Patent number: 5675039
    Abstract: Disclosed are bis-meta-benzotrifluoride compounds having the general formula ##STR1## where each A is independently selected from the group consisting of NO.sub.2, NH.sub.2, and NH.sub.3.sup.+ Z.sup.-, Z.sup.- is an anion and B is selected from the group consisting of O, CO, S, SO, and SO.sub.2. The diamine compounds are useful as monomers in making polyimides, polyamide-imides, and polyamides.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: October 7, 1997
    Inventors: Jeffrey S. Stults, Henry C. Lin, Robert A. Buchanan
  • Patent number: 5498691
    Abstract: Disclosed are bis-meta-benzotrifluoride compounds having the general formula ##STR1## where each A is independently selected from the group consisting of NO.sub.2, NH.sub.2, and NH.sub.3.sup.+ Z.sup.-, Z.sup.- is an anion and B is selected from the group consisting of O, CO, S, SO, and SO.sub.2. The diamine compounds are useful as monomers in making polyimides, polyamide-imides, and polyamides.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: March 12, 1996
    Assignee: Occidental Chemical Corporation
    Inventors: Jeffrey S. Stults, Henry C. Lin, Robert A. Buchanan, Robert L. Ostrozynski
  • Patent number: 5484879
    Abstract: Polyimide polymers of the following recurring structure and the corresponding polyamic acids are disclosed: ##STR1## wherein AR.sub.1 is ##STR2## where X is O, S, SO, SO.sub.2, CO, C(CF.sub.3).sub.2, C(CH.sub.3).sub.2, Si(CH.sub.3).sub.2, or a single bond, wherein AR.sub.2 may be pyromellitic dianhydride, a substituted pyromellitic dianhydride, naphthanoic dianhydride, or ##STR3## where Y is O, S, SO, SO.sub.2, CO, C(CF.sub.3).sub.2, C(CH.sub.3).sub.2, Si(CH.sub.3).sub.2 --O--AR--O--, or a single bond, where AR is an aromatic nucleus.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: January 16, 1996
    Assignee: Occidental Chemical Corporation
    Inventors: Robert A. Buchanan, Jeffrey S. Stults, Ronald F. Spohn
  • Patent number: 5391320
    Abstract: This invention relates to terbium activated silicate luminescent glasses exhibiting reduced afterglow and enhanced luminescence due to incorporation therein of selected rare earth oxides of cerium, europium and gadolinium.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: February 21, 1995
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Robert A. Buchanan, Clifford Bueno
  • Patent number: 5283270
    Abstract: Disclosed are glycidyl diamines having the formulas ##STR1## where n is 1 or 2, m is 0, 1, or 2, X is Y or ##STR2## and Y is --, O, S, SO, SO.sub.2, CO, C(CH.sub.3).sub.2, or C(CF.sub.3).sub.2. An epoxy resin can be made by mixing the glycidyl diamine with an epoxy curing agent. The epoxy resins can be used as adhesives or to make composites.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: February 1, 1994
    Assignee: Occidental Chemical Corporation
    Inventors: Robert A. Buchanan, Robert L. Ostrozynski
  • Patent number: 5185471
    Abstract: A process for the preparation of 1,1'-oxy-bis(3-trifluoromethyl-4-nitrobenzene) which comprises reacting a compound of the formula ##STR1## where X is F, Cl, Br or I; with an inorganic base selected from the group consisting of alkali metal hydroxides, alkali metal carbonates, and alkali metal bicarbonates, in the presence of a catalytic quantity of a benzoate catalyst. In addition, benzoate esters of 4-nitro-3-trifluoromethylphenol may be isolated.
    Type: Grant
    Filed: November 25, 1991
    Date of Patent: February 9, 1993
    Assignee: Occidental Chemical Corporation
    Inventors: Jeffrey S. Stults, Robert A. Buchanan
  • Patent number: 5155750
    Abstract: An object (10) to be radiographically inspected is irradiated in a sequence of different positions with respect to an X-ray beam emitted by a single source (12). A single X-ray detector in an imaging system (13) produces a series of electronic signals corresponding to the sequence of positions at which irradiation of the test object (10) occurs. The series of electronic signals is converted to a pair of series of signals, wherein one series of the pair is delayed with respect to the other series of the pair. The pair of series of signals is displayed as a stereoscopic pair of series of visual images corresponding to different positions at which the test object (10) is irradiated by the X-ray beam. A viewing system (19) causes each eye of an observer to see a different series of visual images, whereby the observer is enabled to preceive a series of stereoscopic X-ray images of the test object (10).
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: October 13, 1992
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Lee M. Klynn, Richard C. Barry, Robert A. Buchanan
  • Patent number: 5122671
    Abstract: This invention relates to terbium activated silicate luminescent glasses exhibiting reduced afterglow and enhanced luminescence due to incorporation therein of selected rare earth oxides of cerium, europium and godolinium.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: June 16, 1992
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Robert A. Buchanan, Clifford Bueno
  • Patent number: 5122613
    Abstract: This invention relates to novel fluorinated N,N-bis-imides of the formula ##STR1## wherein R is a bivalent radical of the formula ##STR2## The compounds are particularly useful as monomers in the preparation of high performance polymer.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: June 16, 1992
    Assignee: Occidental Chemical Corporation
    Inventors: Robert A. Buchanan, Robert L. Ostrozynski, Henry C. Lin
  • Patent number: D809898
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: February 13, 2018
    Assignee: EBULLIENT, INC.
    Inventors: Brett A. Lindeman, Robert A. Buchanan
  • Patent number: D812022
    Type: Grant
    Filed: September 12, 2015
    Date of Patent: March 6, 2018
    Inventor: Robert A. Buchanan