Patents by Inventor Robert A. Buchanan
Robert A. Buchanan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9852963Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.Type: GrantFiled: September 24, 2015Date of Patent: December 26, 2017Assignee: EBULLIENT, INC.Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
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Publication number: 20170105313Abstract: A multi-chamber heat sink module can provide fluid cooling of one or more heat providing surfaces. The module can include a first plurality of orifices fluidly connecting a first inlet chamber to a first outlet chamber. The first outlet chamber can be configured to be bounded by a portion of a heat providing surface. The first plurality of orifices can be configured to deliver a first plurality of jet streams of coolant into the first outlet chamber and against the portion of the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the first inlet chamber. The heat sink module can include a second inlet chamber fluidly connected to a first outlet passage and a second plurality of orifices fluidly connecting the second inlet chamber to a second outlet chamber.Type: ApplicationFiled: October 10, 2015Publication date: April 13, 2017Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan, Mark A. Rodarte
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Publication number: 20160116224Abstract: A flexible cooling line assembly, when fluidly connected to a two-phase cooling apparatus, can provide device-level cooling to one or more devices. The assembly can include a first section of flexible, low-pressure tubing fluidly connected to an inlet port of a heat sink module. The heat sink module can include an inlet chamber fluidly connected to the inlet port and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. The outlet chamber can be fluidly connected to an outlet port of the module, and a second section of flexible, low-pressure tubing can be fluidly connected to the outlet port. The plurality of orifices can deliver a plurality of jet streams of coolant into the outlet chamber and against a heat providing surface when the first heat sink module is mounted to the heat providing surface and when pressurized coolant is delivered to the inlet chamber.Type: ApplicationFiled: September 14, 2015Publication date: April 28, 2016Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
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Publication number: 20160120059Abstract: A two-phase cooling system can include a primary cooling loop and a heat rejection loop. The primary cooling loop can include a reservoir, a first pump fluidly connected to the primary cooling loop downstream of the reservoir, and a heat sink module fluidly connected to the primary cooling loop downstream of the first pump and upstream of the reservoir. The first pump can draw dielectric coolant from the reservoir and provide a primary flow of pressurized dielectric coolant through the primary cooling loop, with a first portion flowing through the heat sink module and a second portion flowing through a bypass. The heat rejection loop can be fluidly connected to the same reservoir and can include a second pump and a heat exchanger. The second pump can draw dielectric coolant from the reservoir and provide a secondary flow of pressurized coolant through the heat exchanger and back to the reservoir.Type: ApplicationFiled: October 27, 2015Publication date: April 28, 2016Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
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Publication number: 20160120071Abstract: A server can include a cooling line assembly to provide fluid cooling of one or more server components. The server can include a chassis, a circuit board positioned within the chassis, and a processor electrically connected to the circuit board. The cooling line assembly can include a heat sink module on a surface to be cooled that is in thermal communication with the processor. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. The orifices can deliver jet streams of coolant into the first outlet chamber and against the surface to be cooled when pressurized coolant is provided to the inlet chamber of the heat sink module.Type: ApplicationFiled: September 20, 2015Publication date: April 28, 2016Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
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Publication number: 20160118317Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.Type: ApplicationFiled: September 24, 2015Publication date: April 28, 2016Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
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Publication number: 20160120019Abstract: A circuit board assembly, such as a motherboard, graphics card, sound card, or network card, can be adapted for fluid cooling. The circuit board assembly can include a processor electrically connected to a printed circuit board. The circuit board assembly can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings by sections of tubing. The heat sink module can be mounted on a surface to be cooled that is a surface of, or a surface in thermal communication with, the processor. When fluidly connected to a cooling system, coolant flowing through the cooling line assembly can flow through a plurality of orifices in the heat sink module forming a plurality of jet streams that are projected against the surface to be cooled, resulting in heat transferring from the processor to the flowing coolant.Type: ApplicationFiled: October 6, 2015Publication date: April 28, 2016Inventors: Timothy A. Shedd, Brett A. Lindeman, Robert A. Buchanan
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Patent number: 6233304Abstract: The present invention, in one form, is a method for generating a calcification score in a CT image data using a scoring algorithm. In accordance with one embodiment of the algorithm, a calcium score is determined by identifying a scorable region in the image data, defining at least one region of interest in the scorable region, and determining a density score. After determining a calcium score for each region of interest, a total calcium score is determined. In addition, to correct for unequal and/or non-contiguous spacing of the slices of image data, a weighted total calcium score is determined.Type: GrantFiled: November 25, 1998Date of Patent: May 15, 2001Assignee: General Electric CompanyInventors: Hui Hu, Robert A. Buchanan, Theophano Mitsa
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Patent number: 5750811Abstract: Disclosed is a method of making m-chlorobenzotrifluoride. Benzotrifluoride is reacted with chlorine gas in the presence of about 0.1 to about 5 mole % (based on benzotrifluoride) of a metal chloride which can be FeCl.sub.3, SbCl.sub.3, or AlCl.sub.3 and about 0.025 to about 5.0 mole % (based on benzotrifluoride) of a catalyst having the formula ##STR1## where Z is halogen, alkyl from C.sub.1 to C.sub.6, alkoxy from C.sub.1 to C.sub.6, or fluoroalkyl from C.sub.1 to C.sub.6, n is 0 to 5, and the molar ratio of metal chloride to cocatalyst is about 0.5 to about 4.Type: GrantFiled: April 7, 1997Date of Patent: May 12, 1998Assignee: Occidental Chemical CorporationInventors: Robert A. Buchanan, Ramesh Krishnamurti, Habib Hichri, David C. Johnson
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Patent number: 5675039Abstract: Disclosed are bis-meta-benzotrifluoride compounds having the general formula ##STR1## where each A is independently selected from the group consisting of NO.sub.2, NH.sub.2, and NH.sub.3.sup.+ Z.sup.-, Z.sup.- is an anion and B is selected from the group consisting of O, CO, S, SO, and SO.sub.2. The diamine compounds are useful as monomers in making polyimides, polyamide-imides, and polyamides.Type: GrantFiled: April 15, 1996Date of Patent: October 7, 1997Inventors: Jeffrey S. Stults, Henry C. Lin, Robert A. Buchanan
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Patent number: 5498691Abstract: Disclosed are bis-meta-benzotrifluoride compounds having the general formula ##STR1## where each A is independently selected from the group consisting of NO.sub.2, NH.sub.2, and NH.sub.3.sup.+ Z.sup.-, Z.sup.- is an anion and B is selected from the group consisting of O, CO, S, SO, and SO.sub.2. The diamine compounds are useful as monomers in making polyimides, polyamide-imides, and polyamides.Type: GrantFiled: October 9, 1990Date of Patent: March 12, 1996Assignee: Occidental Chemical CorporationInventors: Jeffrey S. Stults, Henry C. Lin, Robert A. Buchanan, Robert L. Ostrozynski
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Patent number: 5484879Abstract: Polyimide polymers of the following recurring structure and the corresponding polyamic acids are disclosed: ##STR1## wherein AR.sub.1 is ##STR2## where X is O, S, SO, SO.sub.2, CO, C(CF.sub.3).sub.2, C(CH.sub.3).sub.2, Si(CH.sub.3).sub.2, or a single bond, wherein AR.sub.2 may be pyromellitic dianhydride, a substituted pyromellitic dianhydride, naphthanoic dianhydride, or ##STR3## where Y is O, S, SO, SO.sub.2, CO, C(CF.sub.3).sub.2, C(CH.sub.3).sub.2, Si(CH.sub.3).sub.2 --O--AR--O--, or a single bond, where AR is an aromatic nucleus.Type: GrantFiled: December 17, 1990Date of Patent: January 16, 1996Assignee: Occidental Chemical CorporationInventors: Robert A. Buchanan, Jeffrey S. Stults, Ronald F. Spohn
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Patent number: 5391320Abstract: This invention relates to terbium activated silicate luminescent glasses exhibiting reduced afterglow and enhanced luminescence due to incorporation therein of selected rare earth oxides of cerium, europium and gadolinium.Type: GrantFiled: June 24, 1991Date of Patent: February 21, 1995Assignee: Lockheed Missiles & Space Company, Inc.Inventors: Robert A. Buchanan, Clifford Bueno
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Patent number: 5283270Abstract: Disclosed are glycidyl diamines having the formulas ##STR1## where n is 1 or 2, m is 0, 1, or 2, X is Y or ##STR2## and Y is --, O, S, SO, SO.sub.2, CO, C(CH.sub.3).sub.2, or C(CF.sub.3).sub.2. An epoxy resin can be made by mixing the glycidyl diamine with an epoxy curing agent. The epoxy resins can be used as adhesives or to make composites.Type: GrantFiled: February 5, 1993Date of Patent: February 1, 1994Assignee: Occidental Chemical CorporationInventors: Robert A. Buchanan, Robert L. Ostrozynski
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Patent number: 5185471Abstract: A process for the preparation of 1,1'-oxy-bis(3-trifluoromethyl-4-nitrobenzene) which comprises reacting a compound of the formula ##STR1## where X is F, Cl, Br or I; with an inorganic base selected from the group consisting of alkali metal hydroxides, alkali metal carbonates, and alkali metal bicarbonates, in the presence of a catalytic quantity of a benzoate catalyst. In addition, benzoate esters of 4-nitro-3-trifluoromethylphenol may be isolated.Type: GrantFiled: November 25, 1991Date of Patent: February 9, 1993Assignee: Occidental Chemical CorporationInventors: Jeffrey S. Stults, Robert A. Buchanan
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Patent number: 5155750Abstract: An object (10) to be radiographically inspected is irradiated in a sequence of different positions with respect to an X-ray beam emitted by a single source (12). A single X-ray detector in an imaging system (13) produces a series of electronic signals corresponding to the sequence of positions at which irradiation of the test object (10) occurs. The series of electronic signals is converted to a pair of series of signals, wherein one series of the pair is delayed with respect to the other series of the pair. The pair of series of signals is displayed as a stereoscopic pair of series of visual images corresponding to different positions at which the test object (10) is irradiated by the X-ray beam. A viewing system (19) causes each eye of an observer to see a different series of visual images, whereby the observer is enabled to preceive a series of stereoscopic X-ray images of the test object (10).Type: GrantFiled: February 19, 1992Date of Patent: October 13, 1992Assignee: Lockheed Missiles & Space Company, Inc.Inventors: Lee M. Klynn, Richard C. Barry, Robert A. Buchanan
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Patent number: 5122671Abstract: This invention relates to terbium activated silicate luminescent glasses exhibiting reduced afterglow and enhanced luminescence due to incorporation therein of selected rare earth oxides of cerium, europium and godolinium.Type: GrantFiled: June 24, 1991Date of Patent: June 16, 1992Assignee: Lockheed Missiles & Space Company, Inc.Inventors: Robert A. Buchanan, Clifford Bueno
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Patent number: 5122613Abstract: This invention relates to novel fluorinated N,N-bis-imides of the formula ##STR1## wherein R is a bivalent radical of the formula ##STR2## The compounds are particularly useful as monomers in the preparation of high performance polymer.Type: GrantFiled: May 31, 1991Date of Patent: June 16, 1992Assignee: Occidental Chemical CorporationInventors: Robert A. Buchanan, Robert L. Ostrozynski, Henry C. Lin
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Patent number: D809898Type: GrantFiled: June 11, 2015Date of Patent: February 13, 2018Assignee: EBULLIENT, INC.Inventors: Brett A. Lindeman, Robert A. Buchanan
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Patent number: D812022Type: GrantFiled: September 12, 2015Date of Patent: March 6, 2018Inventor: Robert A. Buchanan