Patents by Inventor Robert A. Clawson

Robert A. Clawson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of soldering components to printed circuit boards
    Patent number: 5111991
    Abstract: The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: May 12, 1992
    Assignee: Motorola, Inc.
    Inventors: Robert A. Clawson, John R. Thome