Abstract: A vehicle with a self-contained cooling and heating capability and a tenting feature for sheltering and controlling the temperature at a given location. Warm air is directed out of a heat chamber through a telescopic tube arrangement which may be horizontally piovoted for improved heat direction. The tube arrangement may also be vertically tipped upwardly and downwardly to maximize directional control of heat output. Heat for melting snow may thereby be directed to specific locations. The tenting arrangement provides elevated and focused heating and little heat waste.

Abstract: A vertically-oriented wafer polishing apparatus and method is disclosed including a vertically-oriented polishing device, a semiconductor wafer carrier and a cleaning module to clean the polishing device by removing contaminants that may scratch the wafer and also reduce the polishing rate of the apparatus. The device reduces the "down time" of a polishing apparatus and, therefore, increases the yield of well-polished wafers in a given time period.

Abstract: An improved Chemical Mechanical Planarization (CMP) method is provided for selectively removing a layer of metallization material such as tungsten or copper and a liner film such as Ti/Tin or Ta/TaN from the surface of an oxide layer of a semiconductor wafer. The method includes removing the metallization and liner layers with a first removal process which utilizes CMP polishing and an alumina-based slurry. The first removal process is stopped after the metallization layer is completely removed and before the liner film is completely removed. The remainder of the liner film is removed using a second removal process which includes CMP polishing using a neutral pH silica-based slurry which is selective to the liner film.