Abstract: The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity.

Abstract: A seat cushion for prolonged sitting, having a thigh cushion coupled to and spaced apart from a back cushion. A seat well is defined between the thigh cushion and the back cushion to remove pressure from the buttocks region. Coupling members couple the thigh cushion and the back cushion, and extend therebetween on either side of the seat well.

Abstract: A seat cushion for prolonged sitting, having a thigh cushion coupled to and spaced apart from a back cushion. A seat well is defined between the thigh cushion and the back cushion to remove pressure from the buttocks region. Coupling members couple the thigh cushion and the back cushion, and extend there between on either side of the seat well.