Abstract: A dispenser (10) for liquid and/or solid chemicals consisting of a reservoir (20), an inlet line (40) and an outlet line (44) both connected into the reservoir. A saddle (52) attaches to an external fluid supply line with inlet and the inlet lines interfacing with the reservoir. A press-in inlet nozzle (64) is disposed in the fluid inlet line and enters upstream into the fluid supply line and a press-in outlet nozzle (66) is attached into the fluid outlet line entering downstream into the fluid supply line. A saddle clamp (76) attaches the saddle enclosing the external fluid supply line, such that when a fluid flows downstream through the fluid supply line the inlet nozzle receives a portion of the flow through velocity ram induction and is introduced into the reservoir where it mixes with liquid and/or solid chemicals, forming a suspended solution.

Abstract: An apparatus for at least one of the transport, storage, and display of one or more items of at least one of apparel and accessories is provided. The apparatus includes at least one crib defined by a bottom plate, a back plate, and first and second side plates, each of the at least one crib for having disposed therein one or more items of at least one of apparel and accessories. The at least one crib includes the bottom plate that is one of square and rectangular in shape, the back plate that is one of square and rectangular in shape, and the first and second side plates that have the same shape and that are facing each other. Each of the back plate and first and second side plates are perpendicular to the bottom plate. One edge of each of the back plate and first and second side plates is coupled to a respective one edge of the bottom plate. One edge of each of first and second side plates is coupled to a respective one edge of the back plat.

Abstract: An apparatus for at least one of the transport, storage, and display of one or more items of at least one of apparel and accessories is provided. The apparatus includes at least one crib defined by a bottom plate, a back plate, and first and second side plates, each of the at least one crib for having disposed therein one or more items of at least one of apparel and accessories. The at least one crib includes the bottom plate that is one of square and rectangular in shape, the back plate that is one of square and rectangular in shape, and the first and second side plates that have the same shape and that are facing each other. Each of the back plate and first and second side plates are perpendicular to the bottom plate. One edge of each of the back plate and first and second side plates is coupled to a respective one edge of the bottom plate. One edge of each of first and second side plates is coupled to a respective one edge of the back plat.

Abstract: An apparatus for sensing one or more physical characteristics of a fluid flowing in a fluid line, in one embodiment having an isolator block mounted onto a fluid line and in another embodiment, having an adapter plate coupled with isolator plate mounted onto a fluid line.

Abstract: An apparatus for sensing one or more physical characteristics of a fluid flowing in a fluid line, in one embodiment having an isolator block mounted onto a fluid line and in another embodiment, having an adapter plate coupled with isolator plate mounted onto a fluid line.

Abstract: A method and system whereby a network management control center can monitor and control point-to-point remote satellite communication links without a physical connection between the remote satellite control modems and the network management control center. This method and system provides greater efficiency with reduced costs through rapid reconfiguration of remote satellite control modems. The method and system can actively cause either remote satellite control modem to terminate link transmission, which allows the network management control center to establish a maintenance link with the other remote satellite control modem, through a local satellite control modem. The maintenance link is used to modify operating parameters of the remote satellite control modem. Once parameters are changed at the first remote satellite control modem, the process is repeated for the other remote satellite control modem.

Abstract: A feedback control system (i.e., a positioner) for precise positioning of a pneumatic actuator by adjusting the flow of air to the pneumatic actuator comprises an adjustable gain mechanism for adjusting the sensitivity of the positioner. The adjustable gain mechanism is coupled between a feedback input device of the positioner and a valve control device and is employed to adjust the amount of air supplied to the pneumatic actuator for a given displacement of the feedback input device. Preferably the adjustable gain mechanism is adjustable through a range of settings between a high gain setting and a low gain setting, the high gain setting allowing a greater range of motion of the valve control device than the low gain setting for a given displacement of the feedback input device.

Abstract: An improved means and method for forming leads to a power device is provided by use of a one-piece leadframe on which the die is mounted and a separate connecting clip between the leadframe and the bonding pad on the semiconductor die. The leadframe has an alignment dimple or groove for receiving a mating alignment feature on one end of the connecting clip. The other end of the connecting clip is located over the bonding pad on the die. Solder is placed between die and the leadframe and between the connecting clip and the bonding pad and between the mating alignment surfaces on the clip and leadframe. When the solder is liquid during assembly the die and clip float thereon and automatically align by surface tension so that the die is centrally located on the die flag, the connection point on the clip is centered on the bonding pad and the mating alignment surfaces on the clip and leadframe are engaged.

Abstract: An improved means and method for forming leads to a power device is provided by use of a one-piece leadframe on which the die is mounted and a separate connecting clip between the leadframe and the bonding pad on the semiconductor die. The leadframe has an alignment dimple or groove for receiving a mating alignment feature on one end of the connecting clip. The other end of the connecting clip is located over the bonding pad on the die. Solder is placed between die and the leadframe and between the connecting clip and the bonding pad and between the mating alignment surfaces on the clip and leadframe. When the solder is liquid during assembly the die and clip float thereon and automatically align by surface tension so that the die is centrally located on the die flag, the connection point on the clup is centered on the bonding pad and the mating alignment surfaces on the clip and leadframe are engaged.