Abstract: An apparatus includes a sensor excited by an input voltage adapted to provide a sensor output first voltage corresponding to a physical input excitation. A transformation circuit device provides the operational voltage to the sensor, detects the sensor output first voltage, nulls an amount of offset voltage in the sensor output first voltage, amplifies the nulled offset sensor output first voltage, and provide a noise filtered and temperature compensated output second voltage. A simulator circuit receives the compensated output second voltage and provides an output third voltage representative of a simulated bridge sensor, being absent of offset voltage, and being independent of temperature dependence and noise in the sensor.

Abstract: Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.

Abstract: An apparatus includes a sensor excited by an input voltage adapted to provide a sensor output first voltage corresponding to a physical input excitation. A transformation circuit device provides the operational voltage to the sensor, detects the sensor output first voltage, nulls an amount of offset voltage in the sensor output first voltage, amplifies the nulled offset sensor output first voltage, and provide a noise filtered and temperature compensated output second voltage. A simulator circuit receives the compensated output second voltage and provides an output third voltage representative of a simulated bridge sensor, being absent of offset voltage, and being independent of temperature dependence and noise in the sensor.

Abstract: Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.

Abstract: A pressure capsule embedded in a pacemaker lead to monitor intracardiac chamber pressure is described. This pressure monitor capsule provides highly accurate pressure readings while insuring a high integrity seal against bodily fluids and tissue growth. The capsule is intended to be embedded into a pacemaker cardiac lead or a catheter with the distal (Tip) isolation diaphragm sensing pressure, coupling the pressure through an air column to a protected sensing MEMS device and providing a secure fluid seal to the lead walls. The proximal (Back) end of the capsule provides the electrical interface through the lead to the pacemaker pulse generator.

Abstract: A pressure capsule embedded in a pacemaker lead to monitor intracardiac chamber pressure is described. This pressure monitor capsule provides highly accurate pressure readings while insuring a high integrity seal against bodily fluids and tissue growth. The capsule is intended to be embedded into a pacemaker cardiac lead or a catheter with the distal (Tip) isolation diaphragm sensing pressure, coupling the pressure through an air column to a protected sensing MEMS device and providing a secure fluid seal to the lead walls. The proximal (Back) end of the capsule provides the electrical interface through the lead to the pacemaker pulse generator.

Abstract: An ablative catheter assembly whose electrode is completely covered by a buffer layer. The buffer layer prevents areas of high current density at the surface of the catheter tip, which helps to reduce popping and clotting. The buffer layer may be in the form of a conductive fluid (such as saline solution) pumped into a cavity surrounding the electrode. In this case, the conductive fluid couples the electrode to the surrounding tissue so that RF energy will pass from the electrode to the tissue, thereby effecting ablation. Also, the buffer layer may be in the form of a porous coating which covers an electrode tip. In this case, blood or fluid which infuses the porous coating couples the electrode tip to the surrounding tissues to be ablated.

Abstract: Guide wire for use in a medical procedure and for use with a power supply comprising a solid core wire having proximal and distal extremities. The proximal extremity has a predetermined diameter. At least a portion of the distal extremity has a reduced size with respect to the predetermined diameter. A flexible coil is secured to the distal extremity of the core wire and extends over the portion of the core wire having a reduced size. An actuator member is disposed proximal of the coil and extends along the core wire. Electrical conductors extend from the proximal extremity of the core wire to the actuator member for supplying heat to the actuator member. The actuator member is formed of a temperature activated metal alloy having a Young's modulus of 4.times.10.sup.6 to 14.times.10.sup.6 psi which increases in stiffness when heat is supplied thereto to increase the stiffness of the guide wire proximally of the coil.

Abstract: The present invention provides compensation for temperature in a transducer by connecting the adjustment resistors to the transducer itself to provide a correct transducer output. A number of switches are used to couple the adjustment resistors to the transducer circuit. An individual resistor may be coupled in parallel or in series with a transducer resistance. The control input for the switches are each coupled to a separate bit output of a multiple bit memory. The memory is programmed to control the duty cycle of the switches when addressed.

Abstract: The fail safe architecture for a computer system includes a read only memory (ROM) self-check module, a random access memory (RAM) self-check module and operation code instructions (op code) self-check module which are actuated periodically by a non-maskable interrupt (NMI) to a microprocessor. The microprocessor then suspends the current applications routine being executed. If the self-check module detects a failure, the microprocessor enters a fail safe trap routine which initially resynchronizes the operation of the microprocessor and then delays the generation of a critical timing pulse (fail safe trigger) with a series of "jump to yourself" steps. The fail safe trigger signal activates a device which sends a fail safe square wave to a narrow bandwidth, digital, band-pass filter.