Patents by Inventor Robert A. Isola

Robert A. Isola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8869922
    Abstract: The motorized wheelbarrow includes a motor and drive train to propel the wheelbarrow. The wheelbarrow includes a wheel, a bucket, a stand, and handles. The motor is mounted underneath the bucket and provides mechanical power to the wheel via a drive train comprising a chain and sprocket configuration or a drive shaft and differential configuration. The motor is controlled with a throttle, push button start, and kill switch provided on the handles of the wheelbarrow. The wheelbarrow also features a handbrake that operates a disk brake provided adjacent the wheel in order to stop the wheelbarrow as needed. The motorized wheelbarrow makes reduces the strain associated with use of a wheelbarrow.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: October 28, 2014
    Inventor: Robert Isola
  • Patent number: 5981870
    Abstract: A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: November 9, 1999
    Assignee: Chrysler Corporation
    Inventors: Tina Barcley, Robert A. Isola, Edward T. Pokriefka, Norman J. Roth, Vasil Germanski
  • Patent number: 5924873
    Abstract: A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: July 20, 1999
    Assignee: Chrysler Corporation
    Inventors: Tina Barcley, Robert A. Isola, Edward T. Pokriefka, Norman J. Roth, Vasil Germanski
  • Patent number: 5917149
    Abstract: A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: June 29, 1999
    Assignee: DaimlerChrysler Corporation
    Inventors: Tina Barcley, Norman J. Roth, Vasil Germanski, Edward T. Pokriefka, Robert A. Isola