Patents by Inventor Robert A. Munroe

Robert A. Munroe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Material feeder, dispensing member and method
    Patent number: 6375035
    Abstract: A material feeder having a flexible rotary dispensing member allows precise control over quantity and flow character of material being dispensed. Also, provided are a flexible dispensing member for a rotary material feeder, and a method of adjusting a dispensing amount on a rotary material feeder by adjusting a curvature of the rotating dispensing member.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: April 23, 2002
    Assignee: Saint-Gobain Abrasives Technology Company
    Inventor: Robert A. Munroe
  • Method for forming interconnect bumps on a semiconductor die
    Patent number: 6107180
    Abstract: A method of forming an interconnect bump structure (32, 33). Under Bumb Metalization 11 (UBM) comprising a chrome layer (16), a copper layer (36), and a tin layer (40) is disclosed. In one embodiment, eutectic solder (45) is then formed over the UBM (11) and reflowed in order to form the interconnect bump stucture. In another embodement, a lead standoff (46) is formed over the UBM (11) before the formation of the eutectic solder (48).
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: August 22, 2000
    Assignee: Motorola, Inc.
    Inventors: Robert A. Munroe, Stuart E. Greer