Patents by Inventor Robert A. Pereira

Robert A. Pereira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9472320
    Abstract: A Metal-Clad cable includes at least two conductor assemblies and a non-linear bonding/grounding conductor within a metal sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. The bonding/grounding conductor includes a plurality of undulations disposed along a length thereof, and is disposed within the metal sheath so that it is in contact with an interior surface of the metal sheath. The bonding/grounding conductor is in cabled relation with the conductor assemblies. The undulations of the bonding/grounding conductor provide a degree of resiliency to the connection between the conductors and the metal sheath to facilitate easy removal of the metal sheath when making terminal connections.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: October 18, 2016
    Assignee: WPFY, Inc.
    Inventors: Stephen A. Lundgren, Skip N. Afdasta, Robert A. Pereira
  • Publication number: 20150129191
    Abstract: An exemplary method may comprise thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also comprise providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to a second fluid source for configuring the network of cooling lines in different states. The method may also comprise delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers both when the network of cooling lines is connected only to the first fluid source and when the network of cooling lines is connected to both the first and second fluid sources.
    Type: Application
    Filed: January 23, 2015
    Publication date: May 14, 2015
    Inventors: Christian L. Belady, Murakami Vance, Robert A. Pereira
  • Patent number: 8946549
    Abstract: A Metal-Clad cable that includes at least two conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. A grounding/bonding strip is disposed within the cable and is in intimate contact with an interior surface of the metal sheath. If a grounding conductor is used, it is either in cabled relationship with the two conductor assemblies or is disposed along the length of the electrical conductors and the metal sheath is disposed over the at least two conductor assemblies and the grounding conductor.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: February 3, 2015
    Assignee: WPFY, Inc.
    Inventors: Paul R. Picard, Joseph D. Colangelo, Robert A. Pereira, Christopher J. DeMello
  • Patent number: 8658900
    Abstract: An AC cable that includes at a plurality of conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. A bonding strip is disposed within the metal sheath and is in contact with the interior surface of the metal sheath to provide an electrical low-impedance fault return path for the AC cable.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: February 25, 2014
    Assignee: WPFY, Inc.
    Inventors: Paul R. Picard, Robert A. Pereira, Christopher J. DeMello, Joseph D. Colangelo
  • Publication number: 20130240237
    Abstract: A Metal-Clad cable includes at least two conductor assemblies and a non-linear bonding/grounding conductor within a metal sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. The bonding/grounding conductor includes a plurality of undulations disposed along a length thereof, and is disposed within the metal sheath so that it is in contact with an interior surface of the metal sheath. The bonding/grounding conductor is in cabled relation with the conductor assemblies. The undulations of the bonding/grounding conductor provide a degree of resiliency to the connection between the conductors and the metal sheath to facilitate easy removal of the metal sheath when making terminal connections.
    Type: Application
    Filed: March 16, 2012
    Publication date: September 19, 2013
    Applicant: WPFY, INC.
    Inventors: Stephen A. Lundgren, Skip N. Afdasta, Robert A. Pereira
  • Publication number: 20120073855
    Abstract: A Metal-Clad cable that includes at least two conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. A grounding/bonding strip is disposed within the cable and is in intimate contact with an interior surface of the metal sheath. If a grounding conductor is used, it is either in cabled relationship with the two conductor assemblies or is disposed along the length of the electrical conductors and the metal sheath is disposed over the at least two conductor assemblies and the grounding conductor.
    Type: Application
    Filed: December 8, 2011
    Publication date: March 29, 2012
    Applicant: WPFY, INC.
    Inventors: Paul Picard, Joseph D. Colangelo, Robert A. Pereira, Christopher DeMello
  • Patent number: 8088997
    Abstract: A Metal-Clad cable that includes at least two conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. A grounding/bonding strip is disposed within the cable and is in intimate contact with an interior surface of the metal sheath. If a grounding conductor is used, it is either in cabled relationship with the two conductor assemblies or is disposed along the length of the electrical conductors and the metal sheath is disposed over the at least two conductor assemblies and the grounding conductor.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: January 3, 2012
    Assignee: WPFY, Inc.
    Inventors: Paul R. Picard, Joseph D. Colangelo, Robert A. Pereira, Christopher J. DeMello
  • Patent number: 7793115
    Abstract: Method, and apparatus for operating a power feed in a computing system. One exemplary embodiment includes monitoring the power feed to ensure the power level of the entire system never remains above a first power level and only remains above a second power level for a period of time determined by a timer level.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: September 7, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roger Edward Tipley, Robert A Pereira, E David Neufeld
  • Publication number: 20090250239
    Abstract: An AC cable that includes at a plurality of conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. A bonding strip is disposed within the metal sheath and is in contact with the interior surface of the metal sheath to provide an electrical low-impedance fault return path for the AC cable.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 8, 2009
    Applicant: WPFY, INC.
    Inventors: Paul R. Picard, Robert A. Pereira, Christopher J. DeMello, Joseph D. Colangelo
  • Publication number: 20090250238
    Abstract: A Metal-Clad cable that includes at least two conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer disposed around the jacket layer along the length of each of the electrical conductors. A grounding/bonding strip is disposed within the cable and is in intimate contact with an interior surface of the metal sheath. If a grounding conductor is used, it is either in cabled relationship with the two conductor assemblies or is disposed along the length of the electrical conductors and the metal sheath is disposed over the at least two conductor assemblies and the grounding conductor.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 8, 2009
    Applicant: WPFY, INC.
    Inventors: Paul Picard, Joseph D. Colangelo, Robert A. Pereira, Christopher J. DeMello
  • Publication number: 20080266726
    Abstract: Embodiments include a server and a sensor that detects when a first fluid line to the server fails so a second fluid line to the server is activated.
    Type: Application
    Filed: April 27, 2007
    Publication date: October 30, 2008
    Inventors: Vance Murakami, Christian L. Belady, Paul L. Perez, Robert A. Pereira
  • Patent number: 7420120
    Abstract: A flexible conduit or cable for electrical wiring having at least one break location along the length of the conduit or cable that is visible on an outer surface of the conduit or cable. The break location enables the conduit or cable to be broken. Also provided is a method for producing the flexible conduit or cable, and an apparatus that includes the flexible conduit or cable.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: September 2, 2008
    Assignee: WPFY, Inc.
    Inventors: Michael J. Vertente, Robert A. Pereira, Skip N. Afdasta
  • Publication number: 20080065921
    Abstract: Method, and apparatus for operating a power feed in a computing system. One exemplary embodiment includes monitoring the power feed to ensure the power level of the entire system never remains above a first power level and only remains above a second power level for a period of time determined by a timer level.
    Type: Application
    Filed: September 13, 2006
    Publication date: March 13, 2008
    Inventors: Roger Edward Tipley, Robert A. Pereira, E. David Neufeld
  • Patent number: 7215535
    Abstract: A modular power distribution system is provided for distributing power within an equipment rack. One particular power distribution system has a control unit that is mounted proximate a rack including a power input for receiving power from a power source located outside the rack. The control unit includes a power converter for converting the received power to an output electrical power, and a plurality of power outlets for providing an electrical connection to the control unit and outputting the output electrical power. This particular power distribution system also includes an extension means mounted proximate the rack and having an electrical power input for input of electrical power to the extension means and a plurality of power outlets adapted to couple with and distribute electrical power to conducting elements that electrically connect the extension means to the mounted equipment.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: May 8, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Robert A. Pereira
  • Patent number: 6826036
    Abstract: A modular power distribution system is provided for distributing power within an equipment rack. A control unit is mounted within the rack having a power input connected to a power source and a converter for converting the input power to a power supply for the rack equipment. The control unit includes a housing and power outlets are provided for electrical connection to the control unit and distributing the converted power supply to the equipment. One or more extension bars are mounted within the rack adjacent a corner support of the rack. The extension bar includes a power inlet and is connected via an electrical conductor to one of the power outlets of the control unit. The extension bar includes a number of power outlets (such as up to or more than 8) adapted for electrical connection to power supply lines (cords or hardwiring) from the rack equipment.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: November 30, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Robert A. Pereira
  • Patent number: 6754057
    Abstract: A method for mounting a component on an assembly is provided, such as to prevent shorting between a voltage plane and a ground plane that may be caused when the component fails and generates temperature rises that result in insulation failure. The method includes removing a section of one or more of the group including a ground plane and a voltage plane in an area of the component, where the area of the section is selected to prevent damage to the component that can be caused by shorting between the ground plane and the voltage plane if insulation failure occurs.
    Type: Grant
    Filed: September 29, 2001
    Date of Patent: June 22, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert A. Pereira, D. Joseph Stoddard
  • Publication number: 20040000815
    Abstract: A modular power distribution system is provided for distributing power within an equipment rack. A control unit is mounted within the rack having a power input connected to a power source and a converter for converting the input power to a power supply for the rack equipment. The control unit includes a housing and power outlets are provided for electrical connection to the control unit and distributing the converted power supply to the equipment. One or more extension bars are mounted within the rack adjacent a corner support of the rack. The extension bar includes a power inlet and is connected via an electrical conductor to one of the power outlets of the control unit. The extension bar includes a number of power outlets (such as up to or more than 8) adapted for electrical connection to power supply lines (cords or hardwiring) from the rack equipment.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 1, 2004
    Inventor: Robert A. Pereira
  • Patent number: 6650537
    Abstract: A DC distribution module for a power supply unit is modular and facilitates thermal cooling of the unit. The power supply unit preferably includes a housing in which one or more power supply modules and the DC distribution module can be inserted. The DC distribution module preferably comprises two power conductors laminated and bonded to a ground conductor. The DC distribution module is relatively thin compared to the power supplies inserted into the power supply unit. By being relatively thin, the DC distribution module, which may carry substantial amounts of current, does not substantially interfere with air movement through the power supply unit for thermal cooling purposes.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: November 18, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert A. Pereira, Paily T. Varghese
  • Publication number: 20030081441
    Abstract: A DC distribution module for a power supply unit is modular and facilitates thermal cooling of the unit. The power supply unit preferably includes a housing in which one or more power supply modules and the DC distribution module can be inserted. The DC distribution module preferably comprises two power conductors laminated and bonded to a ground conductor. The DC distribution module is relatively thin compared to the power supplies inserted into the power supply unit. By being relatively thin, the DC distribution module, which may carry substantial amounts of current, does not substantially interfere with air movement through the power supply unit for thermal cooling purposes.
    Type: Application
    Filed: October 31, 2001
    Publication date: May 1, 2003
    Inventors: Robert A. Pereira, Paily T. Varghese
  • Publication number: 20030063417
    Abstract: A method for mounting a component on an assembly is provided, such as to prevent shorting between a voltage plane and a ground plane that may be caused when the component fails and generates temperature rises that result in insulation failure. The method includes removing a section of one or more of the group including a ground plane and a voltage plane in an area of the component, where the area of the section is selected to prevent damage to the component that can be caused by shorting between the ground plane and the voltage plane if insulation failure occurs.
    Type: Application
    Filed: September 29, 2001
    Publication date: April 3, 2003
    Inventors: Robert A. Pereira, D. Joseph Stoddard