Abstract: A packaging system, packaging method and method of depositing a thin layer of material at a desired location upon a substrate, and in particular a layer of thermally-conductive phase change material at the interface between a heat-dissipating component and heat sink coupled therewith. The packaging comprises a thin layer of material sandwiched between a first base liner and a second top liner. A segment of tape is adhesively bound to the top liner and preferably includes a graspable portion, such as a tab, to enable the same to pull the top liner away from the material to thus leave the layer of material deposited upon the substrate.

Abstract: A method for making a glazed panel, such as a stained glass window, using a hot melt adhesive instead of a conventional, noisome, slow-drying putty, includes the provision of a glass pane, such as a leaded or stained glass pane, having a peripheral margin, a soft metal came, such as a lead came, having a U-shaped channel configured to receive the peripheral margin of the glass pane, and an elongated strip of a hot melt adhesive disposed in the channel of the came. The glass pane is heated, e.g., with a hot air gun, to a temperature above the melting point of the adhesive and its peripheral margin is then inserted into the channel of the came such that the heated peripheral margin of the glass causes the adhesive to melt and adhere the peripheral margin of the glass pane to the interior surface of the channel of the came.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin and, optionally, paraffin and petrolatun having electrically-conductive particles suspended therein, which preferably include graphite diamond, or elemental metals such as silver. In the preferred embodiment, the composition further includes a resin polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for packaging the compositions of the present invention, as well as applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin and, optionally, paraffin and petrolatum having electrically-conductive particles suspended therein, which preferably include graphite diamond, or elemental metals such as silver. In the preferred embodiment, the composition further includes a resin polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for packaging the compositions of the present invention, as well as applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

Abstract: An airfoil launching system having a rod with a structure attached to a first end of the rod. A pusher holds a ring airfoil and has a sufficient coefficient of friction that the ring airfoil will generally rotate with the pusher and is rotatably and slidably mounted on the rod. Propulsive force is provided by resilient bands connected to the structure outward from the rod and to the pusher outward from the central aperture of the pusher. A grip attached to the pusher is utilized to draw the pusher toward the second end of the rod, thereby stretching and energizing the resilient bands, and also to rotate the pusher and, consequently, the airfoil.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: An airfoil launching system having a rod with a structure attached to a first end of the rod. A pusher holds a ring airfoil and has a sufficient coefficient of friction that the ring airfoil will generally rotate with the pusher and is rotatably and slidably mounted on the rod. Propulsive force is provided by resilient bands connected to the structure outward from the rod and to the pusher outward from the central aperture of the pusher. A grip attached to the pusher is utilized to draw the pusher toward the second end of the rod, thereby stretching and energizing the resilient bands, and also to rotate the pusher and, consequently, the airfoil.

Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of graphite suspended therein. In the preferred embodiment, the composition further includes a polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for transferring heat from a heat-dissipating component to a heat dissipater, which comprises applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

Abstract: A ladle for containing molten material, particularly aluminum, and a method for forming the ladle. The ladle is formed from stainless steel, and particularly 10 gauge ASTM/ASI grade 304 stainless steel in plate form. The ladle is formed from pre-cut metal parts which are welded together using TIG welding on the inside seams and metal inert gas welding on the outside seams. The welds extend through the ladle walls and completely incorporate the ladle parts while being essentially free of cracks.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: Headwear that produces sound from a signal is provided by an audio device in addition to the normal features of the headwear. The audio headwear of the present invention may be configured as a visor, goggles or a headband. In a preferred embodiment, the present invention is an audio visor comprising a flexible body, a protective layer and two speaker elements. The speaker elements are attached between the flexible body and the protective layer attached to cover the bottom side of the flexible body. Thus, the speaker elements do not interfere with the operation of flexible body as a visor. The preferred embodiment also comprises conductor leads and an amplifier to adapt the output of the audio device for the speaker elements. In the second embodiment, the audio headwear further comprises a lens attached to the flexible body to form goggles or sunglasses.

Abstract: A cutter link for a chain saw chain containing a conical raker spaced forward of a round cutter face. The raker protects most of the cutter face from sudden impact and, together with the cutting and rake angles of the cutter face, provides for a filing rather than a chiseling action by the cutter link. Saw chains incorporating the novel cutter link are impact and wear resistant.

Abstract: This invention is directed to an apparatus or system which is used for monitoring a storm drain system in order to detect the presence of hydrocarbons or the like therein. The apparatus includes a sensor unit which is arranged to float on the surface of the storm drain effluent. A suitable alarm system is connected to the sensor unit to indicate an activation of the sensor unit. The storm drain is, typically, modified to provide a uniform sensing area adjacent to the sensor unit.