Abstract: In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates.

Abstract: The present invention provides methods and apparatus for controlling gas flow to a semiconductor-processing chamber. The invention includes deactivating ratio setpoint feedback control in a flow ratio controller; initiating gas flow through the flow ratio controller; moving valves of the flow ratio controller to a preset position based on a stored position when an upstream pressure reaches a stored upstream pressure value, wherein the stored position and the stored upstream pressure value were stored during a prior process run; determining that steady state flow ratio controller output flows have been reached; and activating ratio setpoint feedback control in the flow ratio controller. Numerous additional features are disclosed.

Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Abstract: Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects.

Abstract: An intervertebral fusion device for promoting fusion of first and second vertebrae comprises first and second endplate modules. Each endplate module includes an outer surface adapted to interface with vertebral bone and an opposite inner surface. The endplate modules further include an attachment feature. A central module is adapted to extend between the first and second endplate modules and is further adapted for connection with the attachment feature. A through passage extends through the outer and inner surfaces of the each of the first and second endplates and through the central module.

Abstract: An intervertebral fusion device for promoting fusion of first and second vertebrae comprises first and second endplate modules. Each endplate module includes an outer surface adapted to interface with vertebral bone and an opposite inner surface. The endplate modules further include an attachment feature. A central module is adapted to extend between the first and second endplate modules and is further adapted for connection with the attachment feature. A through passage extends through the outer and inner surfaces of the each of the first and second endplates and through the central module.

Abstract: Data values from a plurality of data elements can be combined to form one or more entity identifiers to facilitate identifications of and/or associations among a plurality of data records representing one or more entities. Associated data records can represent the same entity and/or multiple entities that can be properly associated. Associations can be made among two or more unique entities and/or their respective representative data records if they correspond to substantially the same entity identifier. In one embodiment, the number, type, and/or characteristics of values for data elements used to form an entity identifier can be selected so that the entity identifier is substantially statistically unique.

Abstract: In a first aspect, a first method is provided repositioning support provided by an end effector. The first method includes the steps of (1) employing the end effector to support a substrate carrier by a bottom of the substrate carrier; (2) transferring the substrate carrier from the end effector to an intermediate support location, wherein the intermediate support location supports the substrate carrier by a bottom of the substrate carrier; (3) repositioning the end effector proximate an overhead transfer flange of the substrate carrier; (4) employing the end effector to support the substrate carrier by the overhead transfer flange of the substrate carrier; and (5) transferring the substrate carrier from the intermediate support location. Numerous other aspects are provided.

Abstract: Data values from a plurality of data elements can be combined to form one or more entity identifiers to facilitate identifications of and/or associations among a plurality of data records representing one or more entities. Associated data records can represent the same entity and/or multiple entities that can be properly associated. Associations can be made among two or more unique entities and/or their respective representative data records if they correspond to substantially the same entity identifier. In one embodiment, the number, type, and/or characteristics of values for data elements used to form an entity identifier can be selected so that the entity identifier is substantially statistically unique.

Abstract: In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.

Abstract: A multi-piece intervertebral disc augmentation implant that may be assembled within the annulus fibrosus is disclosed. The implant may be guided into a precise location through a relatively small opening in the annulus fibrosus with the aid of an elongated guide.

Abstract: A multi-piece intervertebral disc augmentation implant that may be assembled within the annulus fibrosus is disclosed. The implant may be guided into a precise location through a relatively small opening in the annulus fibrosus with the aid of an elongated guide.

Abstract: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

Abstract: A padlock includes a lock body, a shackle, and a sleeve. The lock body includes opposed front and rear longitudinally extending side walls terminating at first and second end portions. The shackle extends from the first end portion of the lock body. The sleeve covers at least a portion of each of the longitudinally extending side walls, and an internal surface of the sleeve includes at least one longitudinally extending rib contacting at least one of the front and rear longitudinally extending side walls to define a gap between the sleeve and the lock body.

Abstract: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

Abstract: An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

Abstract: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

Abstract: A padlock includes a lock body, a shackle, and a sleeve. The lock body includes opposed front and rear longitudinally extending side walls terminating at first and second end portions. The shackle extends from the first end portion of the lock body. The sleeve covers at least a portion of each of the longitudinally extending side walls, and an internal surface of the sleeve includes at least one longitudinally extending rib contacting at least one of the front and rear longitudinally extending side walls to define a gap between the sleeve and the lock body.

Abstract: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

Abstract: In a first aspect, a first method is provided repositioning support provided by an end effector. The first method includes the steps of (1) employing the end effector to support a substrate carrier by a bottom of the substrate carrier; (2) transferring the substrate carrier from the end effector to an intermediate support location, wherein the intermediate support location supports the substrate carrier by a bottom of the substrate carrier; (3) repositioning the end effector proximate an overhead transfer flange of the substrate carrier; (4) employing the end effector to support the substrate carrier by the overhead transfer flange of the substrate carrier; and (5) transferring the substrate carrier from the intermediate support location. Numerous other aspects are provided.