Abstract: According to an aspect, an electrochemical cell may include a vessel, at least two instances of an anode assembly, at least two instances of an oxygen evolution electrode (OEE), and a gas diffusion electrode (GDE). In the vessel, the GDE may be disposed between mirrored arrangements of the at least two instances of the OEE and the at least two instances of the anode assembly.

Abstract: An image sensor includes a substrate, a thin film transistor on the substrate, a dielectric layer over the thin film transistor, a stacked metal layer on and extending through the dielectric layer to the thin film transistor, a bulk heterojunction layer directly coupled to the stacked metal layer, either a hole transport layer directly coupled to the bulk heterojunction layer, and a top contact layer directly coupled to the hole transport layer, or a top contact layer directly coupled to the bulk heterojunction layer. The bulk heterojunction layer includes an electron donor/acceptor material, the hole transport layer includes a transparent conductive polymer material, and the top contact layer includes a transparent conductive material. The image sensor includes a moisture barrier layer directly coupled to the top contact layer, including an optically clear adhesive and a laminated transparent barrier film.

Abstract: An image sensor includes a substrate, a thin film transistor on the substrate, a dielectric layer over the thin film transistor, a stacked metal layer on and extending through the dielectric layer to the thin film transistor, a bulk heterojunction layer directly coupled to the stacked metal layer, either a hole transport layer directly coupled to the bulk heterojunction layer, and a top contact layer directly coupled to the hole transport layer, or a top contact layer directly coupled to the bulk heterojunction layer. The bulk heterojunction layer includes an electron donor/acceptor material, the hole transport layer includes a transparent conductive polymer material, and the top contact layer includes a transparent conductive material. The image sensor includes a moisture barrier layer directly coupled to the top contact layer, including an optically clear adhesive and a laminated transparent barrier film.

Abstract: A method of forming an organic semiconductor includes forming a thin film transistor (“TFT”) backplane; forming a pixel well over the TFT backplane using a photoresist; performing a first plasma etch of the pixel well; stripping the photoresist in the pixel well; performing a second plasma etch of the pixel well; performing a first wash of the pixel well; exposing the pixel well to ultraviolet light; performing a second wash of the pixel well; and forming an organic photodiode in the pixel well.

Abstract: A method of forming an organic semiconductor includes forming a thin film transistor (“TFT”) backplane; forming a pixel well over the TFT backplane using a photoresist; performing a first plasma etch of the pixel well; stripping the photoresist in the pixel well; performing a second plasma etch of the pixel well; performing a first wash of the pixel well; exposing the pixel well to ultraviolet light; performing a second wash of the pixel well; and forming an organic photodiode in the pixel well.

Abstract: A method of manufacturing an image sensor device includes providing a metalized thin film transistor layer on a glass substrate; forming an inter-layer dielectric layer on the metalized thin film transistor layer; forming a via through the inter-layer dielectric layer; forming a metal layer the inter-layer dielectric and within the inter-layer dielectric layer via for contacting the metalized thin film transistor layer; forming a bank layer on the metal layer and the inter-layer dielectric layer; forming a via through the bank layer; forming an electron transport layer on the bank layer and within the bank layer via for contacting an upper surface of the metal layer; forming a bulk heterojunction layer on the electron transport layer; forming a hole transport layer on the bulk heterojunction layer; and forming a top contact layer on the hole transport layer.

Abstract: A method of manufacturing an image sensor device includes providing a metalized thin film transistor layer on a glass substrate; forming an inter-layer dielectric layer on the metalized thin film transistor layer; forming a via through the inter-layer dielectric layer; forming a metal layer on the inter-layer dielectric for contacting the metalized thin film transistor layer; forming a bank layer on the metal layer and the inter-layer dielectric layer; forming a via through the bank layer; forming an electron transport layer on the bank layer and within the bank layer via for contacting an upper surface of the metal layer; forming a bulk hetero-junction layer on the electron transport layer; forming a hole transport layer on the bulk hetero-junction layer; and forming a top contact layer on the hole transport layer. The bulk hetero-junction layer and/or the top contact layer are applied using a screen printing technique.

Abstract: A method of manufacturing an image sensor device includes providing a metalized thin film transistor layer on a glass substrate; forming an inter-layer dielectric layer on the metalized thin film transistor layer: forming a via through the inter-layer dielectric layer; forming a metal layer the inter-layer dielectric and within the inter-layer dielectric layer via for contacting the metalized thin film transistor layer; forming a bank layer on the metal layer and the inter-layer dielectric layer: forming a via through the bank layer; forming an electron transport layer on the bank layer and within the bank layer via for contacting an upper surface of the metal layer; forming a bulk heterojunction layer on the electron transport layer; forming a hole transport layer on the bulk heterojunction layer; and forming a top contact layer on the hole transport layer.

Abstract: A flat panel image sensor includes a thin film transistor (TFT) and diode array, a conformal insulating layer on a top surface of the TFT and diode array, a planarized dielectric layer on a top surface of the conformal insulating layer, a first metalized via in the planarized dielectric layer and the conformal insulating layer to contact a metalized portion of the TFT and diode array, a second metalized via in the planarized dielectric layer and the conformal insulation layer to contact a diode portion of the TFT and diode array, and a passivation layer over the first and second vias and an upper surface of the planarized dielectric layer.

Abstract: The solution of the present invention provides systems and methods for preserving transport layer header options traversing network devices that terminate transport layer connections. The solution described herein provides a bi-directional intelligent proxying system by which a proxy client exchanges transport layer option information with a proxy server via an application layer protocol. The proxy server, which may be in the form of an appliance, re-injects the transport layer options received from the client into the appropriate network packets communicated on the intended network. Likewise, the proxying appliance can inform the proxy client of transport layer options received from the network, such as via a server. With this solution, devices that transmit control information, exchange communications or other functionality via transport layer options may continue to operate in conjunction with transport layer terminating devices.

Abstract: The solution of the present invention provides systems and methods for preserving transport layer header options traversing network devices that terminate transport layer connections. The solution described herein provides a bi-directional intelligent proxying system by which a proxy client exchanges transport layer option information with a proxy server via an application layer protocol. The proxy server, which may be in the form of an appliance, re-injects the transport layer options received from the client into the appropriate network packets communicated on the intended network. Likewise, the proxying appliance can inform the proxy client of transport layer options received from the network, such as via a server. With this solution, devices that transmit control information, exchange communications or other functionality via transport layer options may continue to operate in conjunction with transport layer terminating devices.

Abstract: A transparent/translucent flexible resilient plastic scooper container for operation by underwater remotely operated vehicle jaws, having a flat-bottomed lower portion hollow bowl and an upper inverted bowl lid rearwardly hinged thereto and resiliently insertable into and withdrawable from the hollow of the lower portion by the closing and opening of the jaws.

Abstract: A transparent/translucent flexible resilient plastic scooper container for operation by underwater remotely operated vehicle jaws, having a flat-bottomed lower portion hollow bowl and an upper inverted bowl lid rearwardly hinged thereto and resiliently insertable into and withdrawable from the hollow of the lower portion by the closing and opening of the jaws.

Abstract: A hand tool for installing small parts such as door bushings in hard to reach areas. The hand tool includes a tool body having a handle section, a transition section and a head section. The head section includes first and second portions. The first and second portions are substantially cylindrical in shape. The diameter of the second portion is smaller than the first portion to readily receive and hold in place a small hollow part such as a bushing. The handle section, transition section and head section are oriented relative to each other to permit an individual to readily install a small part such as bushing in hard to reach areas on the first attempt. Preferably, the transition section and the handle section form an angle greater than 90.degree., while the transition section and the head section form an angle less than 90.degree.. Preferably, the tool body is formed from steel.

Abstract: A system for abstracting the byte ordering of a computer firmware from the operating system by allowing a computer to automatically change endianness under full software control. The byte ordering can be switched completely transparent to the end user during system boot. The system is comprised of hardware and software to run either byte order stand alone software or operating systems on demand.