Abstract: The invention relates to a metallized solar cell and the method of making thereof that includes depositing a metal or metals such as silver, nickel, copper, tin, indium, gallium, or selenium or their alloys on solar cells in a manner to form more substantial and robust electrical contacts that can carry current more efficiently and effectively or to provide the active layers required to convert sunlight into electricity. These deposits also protect the underlying metallic materials from corrosion, oxidation or other environmental changes that would deleteriously affect the electrical performance of the cell. The invention also relates to the use of specialized electroplating chemistries that minimize residual stress and/or are free of organic sulfonic acids to minimize chemical attack on solar cell substrates or prior metallizations that include organic and/or inorganic binders or related materials for depositing the initial metallic portions of the cell.

Abstract: The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this method, the invention is an improvement which comprises treating the articles prior to electroplating to provide the electroplatable portions with enhanced electroplatability. This is achieved by passing a current though a near neutral pH solution that contains a conductivity agent and a buffer to reduce or remove surface oxides and contaminants from such portions without deleteriously affecting the non-electroplatable portions of the articles. When the treated surfaces are subsequently subjected to metal plating, a uniform, smooth metal deposit is achieved.

Abstract: A method of reducing tin whisker formation by creating a tin deposit which is inherently less prone to tin whisker formation or growth facilitated by oxide presence or corrosion reactions on the tin deposit surface. This is obtained by one or more of: (i) the deposition of a fine-grained tin deposit having an average grain diameter in the range of 0.05 to 5 microns; (ii) a phosphorous compound in the solution that is used to electroplate the tin deposit so that that the deposit incorporates trace amounts of phosphorous which in turn reduces tin whisker formation by preventing surface oxides even when exposed to heat or humidity; or (iii) a phosphorous compound, mercaptan, or organic or organo-metallic compound in a solution that applies a protective coating to the surface of a previously electroplated tin deposit, wherein the protective coating acts to minimize or prevent oxide formation or corrosion of the tin deposit during exposure to heat or humidity.

Abstract: The invention relates to a method of reducing tin whisker formation in a plated substrate that includes a surface layer comprising tin. The method includes providing on electroplatable portions of the substrate (a) an underlayer comprising silver or (b) a barrier layer that passes a mechanical load test when the surface layer, after 48 hours of contact with a 1 mm hemispherical tip that carries a load of between 500 to 2000 g, exhibits no whiskers having a length of greater than 5 microns. The underlayer or barrier layer, whichever is present, is provided in a thickness sufficient to prevent formation of intermetallic compounds between the substrate and surface layer so that the surface layer exhibits reduced whisker formation compared to the same surface layer deposited directly upon the substrate. Typically, the underlayer or barrier layer includes 50 to 100% by weight silver or similar ductile material.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention relates to a solution for use in connection with the deposition of tin or tin alloys on platable portions of substrates. This solution comprises water; tin ions in an amount sufficient to provide a tin deposit on platable portions of substrates; a complexing agent of an acid or salt thereof that is stable at a pH of above 5.5 and below 10 present in an amount sufficient to render the metal ion soluble in the solution; and a surfactant of an alkoxylated polyalcohol present in an amount sufficient to complex the metal and render it soluble in the solution to facilitate deposition of tin upon the platable portions of the substrates.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are essentially free of compressive stress or are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The deposits preferably exhibit no compressive stress or exhibit a tensile stress. Also, the most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less.

Abstract: The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution.

Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.

Abstract: The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.