Patents by Inventor ROBERT A. SCHICK

ROBERT A. SCHICK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
    Publication number: 20140349446
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Application
    Filed: August 12, 2014
    Publication date: November 27, 2014
    Applicant: PROMERUS, LLC
    Inventors: CHRISTOPHER APANIUS, ROBERT A. SCHICK, HENDRA NG, ANDREW BELL, WEI ZHANG, PHILLIP S. NEAL