Abstract: A grid welding machine operating continuously based on the electrical resistance principle having a stationary longitudinal frame, whereon a horizontal group of parallel longitudinal wires can continuously be moved in the production direction by means of a feeding device, and having a pulling-off device, by means of which the cross wires can be pulled off a coil or rings and fed transversely to the group of longitudinal wires in a transfer device extending transversely, which transfer device can pick up multiple cross wires and convey them one after the other towards the longitudinal wires and bring them into contact with said longitudinal wires in the correct orientation according to the scaling of the cross wires and drop them there, and having electrodes and counter electrodes the weld surfaces of which can be pressed against each other with the points of intersection formed between the longitudinal wires and the cross wires therebetween.

Abstract: A grid welding machine operating continuously based on the electrical resistance principle having a stationary longitudinal frame, whereon a horizontal group of parallel longitudinal wires can continuously be moved in the production direction by means of a feeding device, and having a pulling-off device, by means of which the cross wires can be pulled off a coil or rings and fed transversely to the group of longitudinal wires in a transfer device extending transversely, which transfer device can pick up multiple cross wires and convey them one after the other towards the longitudinal wires and bring them into contact with said longitudinal wires in the correct orientation according to the scaling of the cross wires and drop them there, and having electrodes and counter electrodes the weld surfaces of which can be pressed against each other with the points of intersection formed between the longitudinal wires and the cross wires therebetween.

Abstract: A straightening roller unit for steel material in wire, rod, or strip form that is to be straightened with straightening rollers cooperating in pairs, which are configured to be positioned against the material to be straightened and to be raised from it. The straightening rollers are driven, and the advancement force required for the straightening operation is introduced into the material to be straightened by friction of the straightening rollers.

Abstract: A bending machine for wire mesh mats, which comprise groups of longitudinal and transverse wires intersecting one another at right angles and welded together at intersecting points. The bending machine operates without a mat inverter and makes bending of the longitudinal and transverse wires of the wire mesh mat possible with both a positive and a negative bending angle.

Abstract: A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacefic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarin and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

Abstract: A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfate ions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. It does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

Abstract: A passivate for tungsten alloy electroplates. The passivate includes an effective quantity of CrO.sub.3 in an aqueous bath having a pH of from about 3.5 to about 7.5.

Abstract: An improved process for purifying a nickel plating bath including a pyridine composition as an additive and which bath contains a breakdown product of the pyridine composition. The process has the following steps:a. adjusting the pH of the nickel plating bath to a pH of equal to or greater than 5.0;b. adding an effective amount of an oxidizing agent; andc. removing the breakdown product from the nickel plating bath.

Abstract: An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.

Abstract: An improved process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer, of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole and/or thiazoline additive compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

Abstract: An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing agent present in an amount sufficient to complex an effective amount of the copper ions present, a bath soluble and compatible buffering agent present in an amount sufficient to stabilize the pH of the electrolyte, hydroxyl and/or hydrogen ions present in an amount to provide a pH of about 6 to about 10.5, and sulfamic acid and the bath soluble and compatible salts thereof present in an amount effective to increase the anode efficiency during the electrodeposition of copper from said electrolyte. The electrolyte can optionally, but preferably further contain ammonium ions in combination with the sulfamic acid constituent to further enhance the anode efficiency and a wetting agent present in an amount up to about 2 g/l.

Abstract: A process for electrodepositing chromium on a conductive substrate employing an electrolyte containing trivalent chromium ions, a complexing agent, and hydrogen ions to provide an acidic pH in which a conductive substrate to be electroplated is immersed in the electrolyte and is cathodically charged and current is passed between the substrate and an anode at least a portion of the surfaces of which is comprised of ferrite whereby the formation of detrimental hexavalent chromium ions in the electrolyte is inhibited and the stability of the pH of the electrolyte is improved.

Abstract: A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.

Abstract: An aqueous bath and process suitable for the electrodeposition of bright, high-leveling nickel-iron alloy deposits on a conductive substrate comprising controlled, effective amounts of nickel ions, iron ions, an iron solubilizing agent, a buffering agent, a primary brightening agent, hydrogen ions to provide a pH of about 2.6 to 4.5 and at least one bath soluble additive agent present in an amount of at least about 2 mg/l, selected from propargyl sulfonic acid, 1-butyne-3-sulfonic acid, 1-pentyne-5-sulfonic acid, 2-butyne-1-sulfonic acid and the alkali metal and ammonium salts thereof. A particularly preferred additive agent comprises propargyl sulfonic acid and the alkali metal and ammonium salts thereof. The invention further contemplates the use of the aforementioned additive agent as a replenishing agent for nickel-iron electroplating solutions and as a rejuvenating agent for restoring the activity and capacity of such aqueous baths to deposit bright, high-leveling nickel-iron alloy deposits.

Abstract: A process and electroplating bath for use in electrodepositing nickel on a base where the electroplating bath includes a coumarin compound and an aryl hydroxy carboxylic acid compound, such as salicylic acid, present in a combined amount effective to provide a ductile, self-leveling nickel deposit. The bath may further include hexyne diol and/or a material selected from the group consisting of primary acetylenic alcohols and adducts of primary acetylenic alcohols, as well as mixtures thereof. It has been found that excellent leveling and physical properties can be maintained utilizing such a bath, while at the same time, the usual coumarin concentration level can be reduced significantly and process life can be dramatically extended. In addition, additives such as butyne diol, and/or aldehydes such as formaldehyde and chloral hydrate may be utilized. It has also been found that corrosion resistance is substantially improved utilizing the process and electroplating bath of the present invention.

Abstract: An improved aqueous acidic trivalent chromium electrolyte and process for increasing the tolerance of such electrolytes to the presence of deleterious contaminating metal ions which normally progressively increase during commercial operation of the electrolyte ultimately resulting in chromium electrodeposits which are commercially unsatisfactory due to the presence of streaks, clouds and hazes in the deposit. The improved composition contains controlled effective amounts of thiazole and benzothiazole compounds which are effective to mask the adverse effects of such contaminating metal impurities and which also enhance the codeposition of such metal contaminants on the parts being plated thereby reducing, and in some instances preventing the progressive accumulation of such contaminating metal ions in the electrolyte.

Abstract: A composite electroplated article and process for making same comprising a body having a plurality of adherent electroplates of controlled thickness and composition thereon. The first layer comprises a nickel-iron alloy containing about 15 to about 50 percent by weight iron; the second layer comprises a nickel-containing plate of a sulfur content of about 0.02 to about 0.5 percent by weight; the third layer comprises a nickel-iron alloy containing about 5 to about 19 percent by weight iron but less iron than the first layer. Optionally, a decorative chromium outer layer is applied to the surface of the third layer, and preferably, an intervening nickel plate is interposed between the third layer and outer chromium layer of a type selected to induce micro-discontinuities in the outer chromium layer.

Abstract: An improved composition and process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

Abstract: A bath composition and method for electrodepositing a cobalt-zinc alloy on a conductive substrate which simulates the appearance of a conventional chromium electrodeposit. The bath comprises an aqueous solution having a pH of about 6 to about 9 containing a controlled ratio of cobalt ions and zinc ions and a complexing agent sufficient to maintain the cobalt and zinc ions in solution. The bath and method are particularly adaptable for rack plating articles to impart a decorative bright chromium-like appearance and semi-bright deposits simulating conventional chromium platings.

Abstract: An aqueous bath and process for the electrodeposition of bright, high-leveling nickel-iron alloy deposits on a conductive substrate comprising controlled effective amounts of nickel ions, iron ions, a bath soluble tartrate complexing agent, a reducing mono or disaccharide, ascorbic and/or isoascorbic acid, a buffering agent, a mixture of primary and secondary nickel brightening agents and hydrogen ions to provide a pH of about 2.6 to about 4.5.