Abstract: A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary of the die but can still fail to fully protect the die from excessive cracks induced by dicing damage, particularly when dicing through brittle, low-k dielectrics. The system, method, and apparatus includes embedding a crack arrest structure (CAS) between adjacent scribe lanes. Upon a mechanical saw dicing the wafer, the CAS creates a moisture diffusion block, and can absorb or significantly diminish the energy of cracks propagating towards the individual die seals. Furthermore, the system, method, and apparatus can be implemented without the need to increase the width of the scribe lanes.

Abstract: A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary of the die but can still fail to fully protect the die from excessive cracks induced by dicing damage, particularly when dicing through brittle, low-k dielectrics. The system, method, and apparatus includes embedding a crack arrest structure (CAS) between adjacent scribe lanes. Upon a mechanical saw dicing the wafer, the CAS creates a moisture diffusion block, and can absorb or significantly diminish the energy of cracks propagating towards the individual die seals. Furthermore, the system, method, and apparatus can be implemented without the need to increase the width of the scribe lanes.

Abstract: The number of good IC (Integrated Circuit) chips per wafer or time to print a wafer is optimized by examining a number of prospective chip-to-wafer offsets, and, for each offset, a number of prospective arrangements of reticle exposures (shot maps). Integrating such a shot map optimization sub-system with a reticle layout (frame generation) sub-system permits creation of an optimal shot map for an IC chip of known size. These two sub-systems can also be used iteratively to explore a range of possible chip sizes, presenting the results in a simple graphical form. The instant invention integrates shot map optimization, frame generation and chip size optimization/visualization into a single system, providing the chip designer with insight into the impact of chip size on manufacturability.